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NLAS2066US

Onsemi

NLAS2066US by Onsemi

NLAS2066US by Onsemi is a CMOS SPST switch with 2 functions, operating at -55 to 125 °C. It has a supply voltage range of 1.65-5.5 V and offers 73 dB isolation. Ideal for military-grade applications requiring fast switching with low on-state resistance of 50 ohm in a compact package style.

Median Price

$0.171

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

$0.185

1k+ parts

$0.153

10k+ parts

$0.137

33,000

-

$0.185

$0.153

$0.137

Avnet

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.160

10k+ parts

$0.150

33,000

-

-

$0.160

$0.150

Verical

USA . 33,000 parts In-Stock

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-

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$0.171

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$0.171

Distributors (In-Stock)

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Digiode

USA . 1,607 parts In-Stock

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$0.144

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1,607

$0.144

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Vyrian

USA . 7,052 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,165 parts In-Stock

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$0.137

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$0.137

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Vigor

Singapore . 136 parts In-Stock

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$0.150

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136

$0.150

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Corohmni

South Africa . 106 parts In-Stock

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$0.152

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106

$0.152

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AZTECH Wire

Italy . 105 parts In-Stock

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$16.030

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105

$16.030

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Continental Prestige Electronics

USA . 33,000 parts In-Stock

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$0.130

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33,000

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$0.130

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Kulean Microsystems

USA . 8,079 parts In-Stock

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Kepictronics

USA . 6,738 parts In-Stock

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SupplyDigital Components

Austria . 6,419 parts In-Stock

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TANS Electronics

Latvia . 5,778 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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UHIMA Technologies

Türkiye . 550 parts In-Stock

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550

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Futuretech Components

Singapore . 549 parts In-Stock

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549

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Microchip USA

USA . 317 parts In-Stock

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Problanco Electronics

Mexico . 109 parts In-Stock

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Overview

Elevate your electronic circuits with the NLAS2066US by Onsemi, a top-quality multiplexer and switch that offers unparalleled performance and reliability. Manufactured by industry leader Onsemi, this product boasts a wide range of applications in various industries. With its small outline, very thin profile, and shrink pitch package style, this versatile component is designed to meet your specific needs. Experience seamless operation and precise control with separate outputs and make-before-break switching. Trust Onsemi's commitment to excellence and innovation for all your electronics projects. Unlock endless possibilities with the NLAS2066US.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and labor costs during manufacturing.

Nominal Supply Voltage (Vsup): 2.3 V

The nominal supply voltage of 2.3V provides compatibility with a wide range of electronic systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand harsh environmental conditions and ensure reliable performance in industrial settings.

Technology: CMOS

The CMOS technology used in this product results in low power consumption, making it energy efficient and extending battery life in portable devices.

Technical Specifications

Multiplexers & Switches NLAS2066US attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

2.3 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Nominal Off-state Isolation:

73 dB

Nominal On-state Resistance Match:

1.3 ohm

Maximum On-state Resistance (Ron):

50 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Maximum Switch-off Time:

10 ns

Maximum Switch-on Time:

9 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

2 mm

Trade Compliance

NLAS2066US Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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