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NL3HS644ABFCTAG

Onsemi

NL3HS644ABFCTAG by Onsemi

NL3HS644ABFCTAG by Onsemi is a 36-terminal SPDT multiplexer with 4 channels. It operates at -40 to 85 °C, with Vsup ranging from 1.65 to 4.5 V. With a max Ron of 12 ohm and 0.09 ohm resistance match, it's ideal for industrial applications requiring precise signal switching in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,837 parts In-Stock

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Digiode

USA . 884 parts In-Stock

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Problanco Electronics

Mexico . 4,472 parts In-Stock

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TANS Electronics

Latvia . 3,287 parts In-Stock

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SupplyDigital Components

Austria . 2,713 parts In-Stock

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Kulean Microsystems

USA . 2,350 parts In-Stock

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Corphita

USA . 1,777 parts In-Stock

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Vigor

Singapore . 731 parts In-Stock

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Corohmni

South Africa . 389 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 274 parts In-Stock

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Overview

Enhance your electronics projects with the NL3HS644ABFCTAG by Onsemi, a top-quality multiplexer and switch that offers unmatched performance and reliability. Manufactured by industry leader Onsemi, this product is designed to meet the highest standards in the market. Perfect for a wide range of applications, this versatile component ensures seamless switching capabilities and precise control. Elevate your designs with the NL3HS644ABFCTAG and experience the value and benefits it brings to your projects. Trust Onsemi for cutting-edge solutions that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V nominal supply voltage is commonly used in many electronics, ensuring compatibility with existing systems.

No. of Terminals: 36

With 36 terminals, this multiplexer/switch offers versatility and flexibility in connecting various components and signals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows for reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures functionality in cold environments without any issues.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering connections, enhancing overall reliability.

Width (mm): 2.34 mm

The compact width of 2.34mm saves space on the PCB, making it ideal for applications with limited board real estate.

No. of Channels: 4

Having 4 channels allows for multiple signal paths, enabling the handling of multiple inputs or outputs efficiently.

Maximum On-state Resistance (Ron): 12 ohm

The low on-state resistance of 12 ohms helps minimize signal loss and distortion, ensuring high-quality performance.

Technical Specifications

Multiplexers & Switches NL3HS644ABFCTAG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

Maximum Input Voltage:

4.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

S-PBGA-B36

Length:

2.34 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Nominal Off-state Isolation:

27 dB

Nominal On-state Resistance Match:

.09 ohm

Maximum On-state Resistance (Ron):

12 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA36,6X6,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.54 mm

Maximum Supply Current (Isup):

.055 mA

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

325 ns

Maximum Switch-on Time:

900 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.34 mm

Trade Compliance

NL3HS644ABFCTAG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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