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NL3HS3124AMNTWG

Onsemi

NL3HS3124AMNTWG by Onsemi

NL3HS3124AMNTWG by Onsemi is a 20-terminal differential multiplexer with 2 channels. It operates in industrial temperature range (-40 to 85 °C) and has a fast switch-on time of 300 ns. Suitable for applications requiring a compact chip carrier package with surface mount capability.

Median Price

$0.670

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 14,030 parts In-Stock

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$0.670

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Flip Electronics (Authorized)

USA . 14,030 parts In-Stock

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Vyrian

USA . 2,404 parts In-Stock

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$0.670

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$0.670

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Maritex

Poland . 2,979 parts In-Stock

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$0.913

100+ parts

$0.535

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$0.496

10k+ parts

$0.442

2,979

$0.913

$0.535

$0.496

$0.442

Flip Electronics

USA . 140,030 parts In-Stock

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Chip Stock

USA . 73,341 parts In-Stock

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Digiode

USA . 1,461 parts In-Stock

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Sensible Micro Corp

USA . 1,064 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Vigor

Singapore . 216 parts In-Stock

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$0.450

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216

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Corohmni

South Africa . 372 parts In-Stock

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$0.670

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SupplyDigital Components

Austria . 7,108 parts In-Stock

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Kulean Microsystems

USA . 5,879 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 4,934 parts In-Stock

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Microchip USA

USA . 4,784 parts In-Stock

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Problanco Electronics

Mexico . 1,463 parts In-Stock

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Corphita

USA . 938 parts In-Stock

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UHIMA Technologies

Türkiye . 116 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the NL3HS3124AMNTWG by Onsemi. Crafted with precision and expertise, this multiplexer offers unparalleled quality and reliability in the realm of switches. Ideal for a wide range of applications, this versatile chip carrier boasts a very thin profile for easy integration. Elevate your projects with the superior performance and efficiency of Onsemi's differential multiplexer. Experience seamless operation and enhanced functionality with the NL3HS3124AMNTWG – your gateway to optimized connectivity.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a circuit board, making installation smooth and efficient.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a commonly used voltage level, ensuring compatibility with various systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package styles provide efficient heat dissipation and space-saving design for compact electronic devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat resistance is essential.

Minimum Operating Temperature: -40 °C

Performs reliably in low temperature environments, ensuring functionality in diverse conditions.

Maximum Switch-on Time: 300 ns

Fast switch-on time allows for quick response and efficient operations in time-sensitive applications.

No. of Channels: 2

Provides flexibility with two channels for efficient signal routing in electronic systems.

Technical Specifications

Multiplexers & Switches NL3HS3124AMNTWG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XQCC-N20

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

50 ns

Maximum Switch-on Time:

300 ns

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.5 mm

Trade Compliance

NL3HS3124AMNTWG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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