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NDDP010N25AZT4H

Onsemi

NDDP010N25AZT4H by Onsemi

NDDP010N25AZT4H by Onsemi is a N-CHANNEL FET with 250V DS Breakdown Voltage, 10A Drain Current, and 0.42 ohm On Resistance. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package suitable for surface mount technology.

Median Price

$0.736

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$0.736

1k+ parts

$0.611

10k+ parts

$0.544

60

-

$0.736

$0.611

$0.544

Distributors (In-Stock)

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Digiode

USA . 716 parts In-Stock

1+ parts

$0.573

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-

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716

$0.573

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Chip Stock

USA . 8,300 parts In-Stock

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8,300

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Vyrian

USA . 6,333 parts In-Stock

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6,333

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Distributors (Availability)

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Corphita

USA . 383 parts In-Stock

1+ parts

$0.543

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383

$0.543

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Corohmni

South Africa . 373 parts In-Stock

1+ parts

$0.603

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373

$0.603

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AZTECH Wire

Italy . 891 parts In-Stock

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$17.810

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891

$17.810

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Perfect Parts

USA . 15,994 parts In-Stock

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15,994

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Kulean Microsystems

USA . 8,350 parts In-Stock

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8,350

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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SupplyDigital Components

Austria . 4,866 parts In-Stock

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Problanco Electronics

Mexico . 4,826 parts In-Stock

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TANS Electronics

Latvia . 1,625 parts In-Stock

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UHIMA Technologies

Türkiye . 839 parts In-Stock

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839

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FE SAS

France . 600 parts In-Stock

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Overview

Discover the power of the NDDP010N25AZT4H by Onsemi, a top-notch small signal Field Effect Transistor designed for switching applications. Crafted with precision and expertise by Onsemi, this N-channel transistor offers unparalleled quality and reliability. With a maximum DS breakdown voltage of 250V and a built-in diode, this transistor provides seamless operation and efficient performance. Whether you're looking to maximize power dissipation or enhance your circuit design, the NDDP010N25AZT4H delivers exceptional value and benefits. Trust Onsemi for cutting-edge technology and elevate your projects to new heights with this versatile FET.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, ensuring long-term reliability.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and reduces the need for additional components.

Transistor Application: SWITCHING

Ideal for applications where fast switching speeds are required.

Minimum DS Breakdown Voltage: 250 V

Can handle high voltages, making it suitable for a variety of applications.

Surface Mount: YES

Easy to integrate into surface mount technology for compact circuit designs.

Maximum Drain Current (Abs) (ID): 10 A

Capable of handling high current loads, suitable for power applications.

Maximum Power Dissipation (Abs): 52 W

Can dissipate significant amounts of power, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, increasing reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high performance and efficiency in a small package size.

Maximum Drain-Source On Resistance: 0.42 ohm

Low on-resistance results in minimal power loss and efficient operation.

Technical Specifications

Small Signal Field Effect Transistors (FET) NDDP010N25AZT4H attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.42 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDDP010N25AZT4H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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