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NDD03N80ZT4G

Onsemi

NDD03N80ZT4G by Onsemi

NDD03N80ZT4G by Onsemi is a Power FET with 800V DS Breakdown Voltage, 12A IDM, and 100mJ EAS. Ideal for applications requiring high power dissipation in a compact form factor. Suitable for enhancement mode operation at up to 150 °C, making it versatile for various industrial uses.

Median Price

$0.502

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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$0.430

10k+ parts

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5,000

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-

$0.430

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Rochester

USA . 4,997 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.371

4,997

-

$0.502

$0.417

$0.371

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.521

10k+ parts

$0.464

2,500

-

-

$0.521

$0.464

Distributors (In-Stock)

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Digiode

USA . 911 parts In-Stock

1+ parts

$0.391

100+ parts

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911

$0.391

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Vyrian

USA . 85 parts In-Stock

1+ parts

$0.412

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85

$0.412

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PC Components Company LLC

USA . 50 parts In-Stock

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50

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Bristol Electronics

USA . 50 parts In-Stock

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50

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Cogito LLC

Ukraine . 3 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,064 parts In-Stock

1+ parts

$0.371

100+ parts

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2,064

$0.371

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Corohmni

South Africa . 284 parts In-Stock

1+ parts

$0.412

100+ parts

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284

$0.412

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Kulean Microsystems

USA . 6,409 parts In-Stock

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6,409

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A-Z Elektronik GmbH

Germany . 6,143 parts In-Stock

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Assy Fe

Spain . 4,112 parts In-Stock

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SupplyDigital Components

Austria . 3,691 parts In-Stock

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3,691

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Problanco Electronics

Mexico . 3,334 parts In-Stock

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3,334

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TANS Electronics

Latvia . 2,581 parts In-Stock

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2,581

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Perfect Parts

USA . 2,248 parts In-Stock

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2,248

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UHIMA Technologies

Türkiye . 632 parts In-Stock

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632

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Experience the superior quality and performance of the NDD03N80ZT4G by Onsemi, a leading manufacturer in the field of Power Field Effect Transistors (FET). This N-channel transistor with a built-in diode offers unmatched reliability and efficiency, making it ideal for various applications. From power supplies to motor control, this transistor excels in enhancing your electronic designs. Trust Onsemi's expertise and innovation to deliver the best value and benefits to meet your needs. Elevate your projects with the NDD03N80ZT4G and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier and more efficient circuit design, saving space and reducing the need for additional components.

Surface Mount: YES

Surface mount packaging offers space-saving benefits and allows for automated assembly processes, making it ideal for high-volume production.

Minimum DS Breakdown Voltage: 800 V

The high breakdown voltage ensures the FET can handle high voltages safely, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 12 A

The high pulsed drain current rating allows the FET to handle short-term high-current loads without overheating or failing.

Maximum Power Dissipation (Abs): 96 W

With a high power dissipation rating, this FET can efficiently handle high power loads and operate reliably under demanding conditions.

Maximum Operating Temperature: 150 °C

The high operating temperature range ensures the FET can withstand elevated temperatures without performance degradation, making it suitable for a wide range of environments.

Technical Specifications

Power Field Effect Transistors (FET) NDD03N80ZT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

2.9 A

Maximum Drain Current (ID):

1.9 A

Maximum Drain-Source On Resistance:

4.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NDD03N80ZT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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