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NDBA180N10BT4H

Onsemi

NDBA180N10BT4H by Onsemi

NDBA180N10BT4H by Onsemi is a Power FET with 100V DS Breakdown Voltage, 600A IDM, and 0.0033 ohm RDS. Ideal for SWITCHING applications, it features an N-CHANNEL configuration in a PLASTIC/EPOXY package with GULL WING terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,982 parts In-Stock

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Digiode

USA . 1,598 parts In-Stock

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Flip Electronics

USA . 650 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$1.430

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$1.301

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$1.173

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AZTECH Wire

Italy . 425 parts In-Stock

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$18.440

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A-Z Elektronik GmbH

Germany . 5,979 parts In-Stock

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SupplyDigital Components

Austria . 5,735 parts In-Stock

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Perfect Parts

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TANS Electronics

Latvia . 2,940 parts In-Stock

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Problanco Electronics

Mexico . 2,922 parts In-Stock

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Kulean Microsystems

USA . 2,014 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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GreenTree Electronics

Israel . 630 parts In-Stock

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UHIMA Technologies

Türkiye . 501 parts In-Stock

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Corphita

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Corohmni

South Africa . 249 parts In-Stock

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Overview

Enhance your electronic projects with the NDBA180N10BT4H from Onsemi, a high-quality Power Field Effect Transistor with a built-in diode. Ideal for switching applications, this N-channel transistor offers reliable performance and efficiency. With a 100V minimum DS breakdown voltage and a maximum pulsed drain current of 600A, this transistor is designed to meet your power needs. Whether you're working on automotive, industrial, or consumer electronics, the NDBA180N10BT4H provides the durability and functionality you need. Elevate your designs with Onsemi's innovative technology and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and higher switching speeds compared to P-Channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects against reverse current flow, enhancing the reliability and efficiency of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation when turning a load on and off.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 100 V

High breakdown voltage ensures that the FET can safely handle high voltage applications, providing robust protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 600 A

High pulsed drain current capability allows the FET to handle short duration high current spikes, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 451 mJ

Good avalanche energy rating indicates the FET's ability to withstand high-energy transient events, enhancing its reliability under extreme conditions.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance ensures the FET can operate reliably in elevated temperature environments without overheating.

Maximum Drain-Source On Resistance: 0.0033 ohm

Low on-resistance leads to reduced power losses and improved efficiency in the FET, making it suitable for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) NDBA180N10BT4H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA LOW RESISTANCE

Avalanche Energy Rating (EAS):

451 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0033 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

600 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDBA180N10BT4H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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