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NCV97311MW50AR2G

Onsemi

NCV97311MW50AR2G by Onsemi

NCV97311MW50AR2G by Onsemi is a Power Management IC with 32 terminals, operating temperature range of -40 to 125 °C. It has a nominal voltage of 13.2 V and is suitable for automotive applications due to its adjustable threshold feature and max supply voltage of 34 V.

Median Price

$3.182

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 175 parts In-Stock

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$3.182

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175

$3.182

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Flip Electronics

USA . 135,000 parts In-Stock

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Vyrian

USA . 8,011 parts In-Stock

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8,011

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Distributors (Availability)

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Corphita

USA . 389 parts In-Stock

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$3.015

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389

$3.015

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Corohmni

South Africa . 472 parts In-Stock

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$3.350

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472

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AZTECH Wire

Italy . 564 parts In-Stock

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$13.940

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564

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iodParts Technologies Inc.

India . 234,212 parts In-Stock

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Perfect Parts

USA . 16,677 parts In-Stock

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Kulean Microsystems

USA . 6,861 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 4,960 parts In-Stock

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4,960

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Problanco Electronics

Mexico . 4,872 parts In-Stock

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TANS Electronics

Latvia . 1,235 parts In-Stock

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SupplyDigital Components

Austria . 981 parts In-Stock

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981

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UHIMA Technologies

Türkiye . 1 parts In-Stock

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Overview

Enhance your power management solutions with the NCV97311MW50AR2G by Onsemi. Known for their top-quality manufacturing, Onsemi delivers reliable performance and durability. This Power Management IC is perfect for automotive applications, offering customers a versatile and efficient solution. With surface mount capability and a compact square package shape, this IC is easy to install and saves space in your project. Stay ahead of the competition with the value and benefits that the NCV97311MW50AR2G provides, giving you peace of mind and unmatched performance for all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting onto a PCB, saving space and simplifying assembly process.

Nominal Supply Voltage (Vsup): 13.2 V

Provides a stable and optimized voltage level for reliable power management in various applications.

Maximum Operating Temperature: 125 °C

Ensures the IC can withstand high temperature environments, making it suitable for automotive and industrial use.

Terminal Finish: MATTE TIN

Matte tin finish ensures good electrical conductivity and solderability, improving overall performance and reliability.

Moisture Sensitivity Level (MSL): 3

Indicates that the IC is moderately sensitive to moisture, which is important for long-term reliability in various operating conditions.

Technical Specifications

Power Management ICs NCV97311MW50AR2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

34 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

13.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

NCV97311MW50AR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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