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NCV551SN33T1

Onsemi

NCV551SN33T1 by Onsemi

NCV551SN33T1 by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.15A. It operates in temperatures ranging from -40 to 125 °C, making it suitable for various applications requiring stable voltage regulation in automotive electronics and industrial equipment. With a compact package style and surface-mount capability, this CMOS technology-based regulator offers precise voltage control with low dropout voltage for efficient power management solutions.

Median Price

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Lifecycle Status

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5

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1k+

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AZTECH Wire

Italy . 1,064 parts In-Stock

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TANS Electronics

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Problanco Electronics

Mexico . 5,434 parts In-Stock

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SupplyDigital Components

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Overview

Unleash the power of reliable voltage regulation with the NCV551SN33T1 by Onsemi. Crafted with precision and quality in mind, this Fixed Positive Single Output LDO Regulator offers a seamless solution for various applications. From maintaining stable voltages to ensuring optimal performance, this regulator delivers unparalleled value and benefits to customers. Trust in Onsemi's expertise and elevate your projects with the NCV551SN33T1 - the perfect choice for all your voltage regulation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and reliable package for the regulator, ensuring long-lasting performance.

Maximum Dropout Voltage-1: 0.15 V

Low dropout voltage ensures efficient power conversion and minimal energy loss.

Surface Mount: YES

Easy and convenient installation on PCBs, saving time and effort during assembly.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range allows the regulator to function in various environmental conditions.

Technology: CMOS

CMOS technology enables low power consumption and high efficiency in voltage regulation.

Nominal Output Voltage-1: 3.3 V

Stable output voltage ensures consistent performance of connected devices.

Maximum Output Current-1: 0.15 A

Sufficient output current for powering various electronic components and circuits.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV551SN33T1 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.15 V

Nominal Dropout Voltage-1:

.04 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

12 V

Minimum Input Voltage:

4.3 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

Maximum Line Regulation:

.03 %

Maximum Load Regulation:

.065 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.399 V

Minimum Output Voltage-1:

3.201 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.5 mm

Trade Compliance

NCV551SN33T1 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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