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NCT210RQR2G

Onsemi

NCT210RQR2G by Onsemi

NCT210RQR2G by Onsemi is a Power Management IC with 16 terminals, operating b/w -55 to 125 °C. It supports a nominal voltage of 3.3 V and has a max seated height of 1.73 mm. Ideal for military-grade applications requiring power supply support circuits in compact spaces.

Median Price

$3.858

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,917 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

$3.070

10k+ parts

$2.890

2,917

-

$3.430

$3.070

$2.890

Verical

USA . 1,998 parts In-Stock

1+ parts

-

100+ parts

$4.287

1k+ parts

$3.837

10k+ parts

$3.612

1,998

-

$4.287

$3.837

$3.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,510 parts In-Stock

1+ parts

$3.629

100+ parts

-

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-

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1,510

$3.629

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Vyrian

USA . 3,435 parts In-Stock

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3,435

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Distributors (Availability)

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Corohmni

South Africa . 418 parts In-Stock

1+ parts

$3.160

100+ parts

-

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418

$3.160

-

-

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Corphita

USA . 1,419 parts In-Stock

1+ parts

$3.438

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-

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1,419

$3.438

-

-

-

AZTECH Wire

Italy . 1,217 parts In-Stock

1+ parts

$10.260

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1,217

$10.260

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Perfect Parts

USA . 10,366 parts In-Stock

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Kulean Microsystems

USA . 5,759 parts In-Stock

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5,759

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A-Z Elektronik GmbH

Germany . 5,346 parts In-Stock

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5,346

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Problanco Electronics

Mexico . 5,105 parts In-Stock

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TANS Electronics

Latvia . 3,371 parts In-Stock

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3,371

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Continental Prestige Electronics

USA . 2,917 parts In-Stock

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$3.160

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2,917

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$3.160

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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GreenTree Electronics

Israel . 1,835 parts In-Stock

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1,835

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SupplyDigital Components

Austria . 873 parts In-Stock

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873

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Futuretech Components

Singapore . 679 parts In-Stock

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679

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UHIMA Technologies

Türkiye . 119 parts In-Stock

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119

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Kepictronics

USA . 90 parts In-Stock

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90

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Overview

Enhance your power management capabilities with the NCT210RQR2G by Onsemi, a top-tier manufacturer known for their high-quality ICs. This Power Management IC offers unmatched reliability and efficiency in a compact package, making it ideal for a wide range of applications. Whether you're looking to optimize power supply support circuits or enhance your overall system performance, this product delivers exceptional value and benefits. Trust Onsemi to provide you with cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications while also providing a cost-effective solution.

Surface Mount: YES

Allows for easy and efficient mounting onto circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3.3 V

Provides a stable and reliable power source for the connected devices, ensuring consistent performance.

No. of Terminals: 16

Sufficient number of terminals to accommodate connections to different components, enabling versatile usage.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for demanding environments and ensuring longevity.

Technical Specifications

Power Management ICs NCT210RQR2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

4.89 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.64 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCT210RQR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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