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NCS37005MNG

Onsemi

NCS37005MNG by Onsemi

NCS37005MNG by Onsemi is a Power Management IC with 16 terminals in a square package. It operates b/w -40 to 85 °C, supporting supply voltages from 6V to 18V. Ideal for industrial applications requiring compact and efficient power supply support circuits.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,762 parts In-Stock

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Digiode

USA . 351 parts In-Stock

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AZTECH Wire

Italy . 206 parts In-Stock

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$21.500

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Component Stockers USA

USA . 262 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 7,159 parts In-Stock

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Problanco Electronics

Mexico . 6,867 parts In-Stock

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TANS Electronics

Latvia . 6,135 parts In-Stock

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SupplyDigital Components

Austria . 5,881 parts In-Stock

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Corphita

USA . 1,673 parts In-Stock

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UHIMA Technologies

Türkiye . 917 parts In-Stock

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Corohmni

South Africa . 491 parts In-Stock

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Microchip USA

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Overview

Looking for a reliable and high-quality power management solution? Look no further than the NCS37005MNG by Onsemi. With a reputation for excellence in manufacturing, Onsemi delivers top-notch Power Management ICs that are perfect for a wide range of applications. From industrial to consumer electronics, this product offers unparalleled value, benefits, and advantages to customers. Say goodbye to worries about power supply support circuit issues and say hello to seamless performance with the NCS37005MNG. Trust Onsemi to provide you with the best in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and cost-effective, making the product easy to handle and affordable for mass production.

Surface Mount: YES

Surface mount technology allows for automated assembly, reducing production costs and improving reliability.

Package Shape: SQUARE

Square package shape provides efficient use of board space and easy alignment during assembly.

No. of Terminals: 16

Having 16 terminals allows for multiple connection options and functionality in a compact package.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design helps in efficient heat dissipation and space-saving in compact devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the product to withstand harsh environmental conditions and extended use.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and establishes secure connections for stable performance.

Maximum Seated Height: 1 mm

Low maximum seated height contributes to a slim design and facilitates integration into space-constrained applications.

Width (mm): 3 mm

Narrow width enables compact placement on the PCB, supporting miniaturization of the overall system.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC can efficiently manage and regulate power distribution within a system, enhancing overall performance and reliability.

Minimum Supply Voltage (Vsup): 6 V

A low minimum supply voltage requirement makes the product suitable for a wide range of applications, including those with lower power sources.

Length: 3 mm

Compact length allows for efficient use of board space and supports the design of sleek, slim devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can withstand harsh operating conditions prevalent in industrial settings.

Terminal Form: NO LEAD

No-lead terminal form offers improved solder joint reliability and allows for better thermal conductivity, enhancing overall performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm facilitates high-density mounting and enables space-efficient PCB layouts.

Maximum Supply Voltage (Vsup): 18 V

High maximum supply voltage capability allows the product to be used in applications requiring higher power handling capacity and flexibility.

Technical Specifications

Power Management ICs NCS37005MNG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

NCS37005MNG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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