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NCS37005DAG

Onsemi

NCS37005DAG by Onsemi

NCS37005DAG by Onsemi is a Power Management IC with 16 terminals in a small outline package. It operates b/w -40 to 85 °C, supporting supply voltages from 6V to 18V. Ideal for industrial applications requiring compact and efficient power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,823 parts In-Stock

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Digiode

USA . 614 parts In-Stock

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Kulean Microsystems

USA . 5,885 parts In-Stock

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Problanco Electronics

Mexico . 3,207 parts In-Stock

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TANS Electronics

Latvia . 3,185 parts In-Stock

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SupplyDigital Components

Austria . 945 parts In-Stock

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UHIMA Technologies

Türkiye . 849 parts In-Stock

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Corohmni

South Africa . 359 parts In-Stock

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Corphita

USA . 138 parts In-Stock

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Overview

Experience superior power management with the NCS37005DAG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This Power Management IC is perfect for a wide range of applications, offering customers unmatched value and benefits. Trust in Onsemi to provide you with cutting-edge technology that ensures optimal performance every time. Elevate your power management solutions with the NCS37005DAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during handling.

Surface Mount: YES

Surface mountability allows for easy and secure installation on circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various components in the circuit, enhancing versatility.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function effectively in cold environments without risk of damage.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and ensures secure connections, enhancing overall reliability.

Width (mm): 4.4 mm

Compact width of 4.4 mm enables the product to be used in space-constrained applications.

Minimum Supply Voltage (Vsup): 6 V

Low minimum supply voltage of 6 V allows for efficient power management in energy-sensitive applications.

Maximum Supply Voltage (Vsup): 18 V

High maximum supply voltage of 18 V provides flexibility for use in a wide range of power supply configurations.

Technical Specifications

Power Management ICs NCS37005DAG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

NCS37005DAG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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