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NCS37005DARG

Onsemi

NCS37005DARG by Onsemi

NCS37005DARG by Onsemi is a Power Management IC with 16 terminals in a small outline package. It operates b/w -40 to 85 °C, supporting supply voltages from 6V to 18V. Ideal for industrial applications requiring power supply support circuits in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,453 parts In-Stock

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Vyrian

USA . 804 parts In-Stock

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TANS Electronics

Latvia . 5,686 parts In-Stock

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SupplyDigital Components

Austria . 2,229 parts In-Stock

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Kulean Microsystems

USA . 1,986 parts In-Stock

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Problanco Electronics

Mexico . 1,873 parts In-Stock

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Corohmni

South Africa . 470 parts In-Stock

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UHIMA Technologies

Türkiye . 418 parts In-Stock

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Corphita

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Overview

Enhance your power management solutions with the NCS37005DARG by Onsemi. Crafted with precision and reliability, this Power Management IC is designed to meet the highest industry standards. With a wide range of applications in various industries, this product offers unmatched performance, efficiency, and durability. Upgrade your systems today and experience the seamless integration, enhanced functionality, and cost-effectiveness that the NCS37005DARG brings to your projects. Trust Onsemi for superior quality and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount capability makes it easier to integrate the IC into various circuit designs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of board space and easy placement on PCBs.

No. of Terminals: 16

Having 16 terminals provides flexibility in connectivity options for power management.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand harsh environments and extended use.

Minimum Operating Temperature: -40 °C

The wide range of operating temperature ensures reliability in both extreme cold and hot conditions.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved connectivity for stability.

Maximum Seated Height: 1.2 mm

Low seated height makes it suitable for compact devices with limited space.

Width (mm): 4.4 mm

The narrow width allows for efficient use of board space and compact designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC is essential for stable power management in various applications.

Minimum Supply Voltage (Vsup): 6 V

The minimum supply voltage of 6V ensures compatibility with a wide range of power sources.

Length: 5 mm

Compact length of 5mm allows for space-saving integration in electronic devices.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this IC is suitable for applications requiring high reliability and durability.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering and connection for stable performance.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65mm enables high-density mounting and compact circuit designs.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage of 18V allows for compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs NCS37005DARG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

NCS37005DARG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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