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NCS2540DTBR2G

Onsemi

NCS2540DTBR2G by Onsemi

NCS2540DTBR2G by Onsemi is a 16-terminal operational amplifier with small outline and thin profile. It features bipolar technology, nickel palladium gold finish, and operates in industrial temperature grade. Ideal for applications requiring high-performance amplification in compact spaces.

Median Price

$2.663

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,965 parts In-Stock

1+ parts

-

100+ parts

$2.380

1k+ parts

$2.130

10k+ parts

$2.000

4,965

-

$2.380

$2.130

$2.000

DigiKey

USA . 4,965 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

-

10k+ parts

-

4,965

-

$3.130

-

-

Verical

USA . 4,965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.663

10k+ parts

$2.500

4,965

-

-

$2.663

$2.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 253 parts In-Stock

1+ parts

$2.508

100+ parts

-

1k+ parts

-

10k+ parts

-

253

$2.508

-

-

-

Chip Stock

USA . 30,000 parts In-Stock

1+ parts

-

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30,000

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Vyrian

USA . 10,364 parts In-Stock

1+ parts

-

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10,364

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,708 parts In-Stock

1+ parts

$2.376

100+ parts

-

1k+ parts

-

10k+ parts

-

1,708

$2.376

-

-

-

Vigor

Singapore . 561 parts In-Stock

1+ parts

$2.540

100+ parts

-

1k+ parts

-

10k+ parts

-

561

$2.540

-

-

-

Corohmni

South Africa . 374 parts In-Stock

1+ parts

$2.640

100+ parts

-

1k+ parts

-

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374

$2.640

-

-

-

AZTECH Wire

Italy . 473 parts In-Stock

1+ parts

$18.060

100+ parts

-

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473

$18.060

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 8,707 parts In-Stock

1+ parts

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8,707

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Microchip USA

USA . 6,991 parts In-Stock

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6,991

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Problanco Electronics

Mexico . 6,647 parts In-Stock

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6,647

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Continental Prestige Electronics

USA . 4,965 parts In-Stock

1+ parts

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100+ parts

$2.500

1k+ parts

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10k+ parts

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4,965

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$2.500

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TANS Electronics

Latvia . 4,792 parts In-Stock

1+ parts

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4,792

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Kulean Microsystems

USA . 1,019 parts In-Stock

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1,019

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Metaverse IC Inc.

Canada . 951 parts In-Stock

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951

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Kepictronics

USA . 851 parts In-Stock

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851

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Futuretech Components

Singapore . 680 parts In-Stock

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680

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SupplyDigital Components

Austria . 679 parts In-Stock

1+ parts

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100+ parts

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679

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UHIMA Technologies

Türkiye . 471 parts In-Stock

1+ parts

-

100+ parts

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471

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Overview

Unlock the potential of your electronic designs with the NCS2540DTBR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their operational amplifiers. The NCS2540DTBR2G offers 3 functions in a compact, surface-mount package, making it ideal for a wide range of applications. With its small outline and thin profile, this amplifier provides exceptional performance while saving valuable space on your PCB. Trust Onsemi to provide you with the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good mechanical strength and insulation for reliable operation.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and improving manufacturability.

No. of Functions: 3

With 3 functions in one device, this operational amplifier offers versatility and flexibility for various circuit designs.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and compatible with standard PCB layouts, simplifying integration.

No. of Terminals: 16

Having 16 terminals provides ample connection options for different circuit configurations and components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a compact design with reduced height and small footprint, ideal for space-constrained applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish ensures good conductivity, corrosion resistance, and reliable solder joints for long-term performance.

Terminal Position: DUAL

Dual terminal position allows for versatility in circuit layout and connection options, enhancing design flexibility.

Maximum Seated Height: 1.2 mm

Low maximum seated height contributes to a compact and slim profile, making it suitable for applications with limited space.

Width: 4.4 mm

Narrow width enables close placement of components on the PCB, optimizing layout efficiency and reducing signal interference.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering during manufacturing processes, increasing product durability.

Length: 5 mm

Compact length allows for efficient use of board space and easy integration into existing circuit designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable operation over a wide range of temperatures, suitable for harsh environment applications.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise performance, making this operational amplifier suitable for demanding signal processing applications.

Terminal Form: GULL WING

Gull wing terminal form provides easy soldering and secure mechanical connections, enhancing reliability in various operating conditions.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design offers high gain, stability, and precision for a wide range of analog signal processing applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on the PCB, enabling complex circuit designs and saving valuable board space.

Technical Specifications

Operational Amplifiers (Op Amps) NCS2540DTBR2G attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

3

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

16

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

NCS2540DTBR2G Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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