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NCS2502DR2G

Onsemi

NCS2502DR2G by Onsemi

NCS2502DR2G by Onsemi is an operational amplifier with 8 terminals in a small outline package. It features a peak reflow temperature of 260 °C, suitable for industrial applications. With bipolar technology and gull wing terminal form, it is ideal for surface mount designs requiring precise signal amplification.

Median Price

$1.313

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,962 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.050

10k+ parts

$0.940

4,962

-

$1.270

$1.050

$0.940

DigiKey

USA . 4,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.590

10k+ parts

-

4,962

-

-

$1.590

-

Verical

USA . 4,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.313

10k+ parts

$1.175

4,962

-

-

$1.313

$1.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 563 parts In-Stock

1+ parts

$0.988

100+ parts

-

1k+ parts

-

10k+ parts

-

563

$0.988

-

-

-

Chip Stock

USA . 57,000 parts In-Stock

1+ parts

-

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57,000

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Vyrian

USA . 9,275 parts In-Stock

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9,275

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Prism Electronics

USA . 15 parts In-Stock

1+ parts

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,179 parts In-Stock

1+ parts

$0.936

100+ parts

-

1k+ parts

-

10k+ parts

-

2,179

$0.936

-

-

-

Vigor

Singapore . 551 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

551

$1.000

-

-

-

Corohmni

South Africa . 57 parts In-Stock

1+ parts

$1.040

100+ parts

-

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57

$1.040

-

-

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AZTECH Wire

Italy . 1,188 parts In-Stock

1+ parts

$15.810

100+ parts

-

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1,188

$15.810

-

-

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Problanco Electronics

Mexico . 8,231 parts In-Stock

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8,231

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Kulean Microsystems

USA . 7,157 parts In-Stock

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7,157

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SupplyDigital Components

Austria . 5,204 parts In-Stock

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5,204

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Kepictronics

USA . 5,100 parts In-Stock

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5,100

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Continental Prestige Electronics

USA . 4,962 parts In-Stock

1+ parts

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100+ parts

$0.984

1k+ parts

-

10k+ parts

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4,962

-

$0.984

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TANS Electronics

Latvia . 3,047 parts In-Stock

1+ parts

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3,047

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UHIMA Technologies

Türkiye . 874 parts In-Stock

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874

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Microchip USA

USA . 372 parts In-Stock

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372

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Perfect Parts

USA . 17 parts In-Stock

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17

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Overview

Discover the NCS2502DR2G by Onsemi, a top-quality operational amplifier that offers unmatched performance and reliability. Manufactured by Onsemi, a leading name in the industry, this product is perfect for a wide range of applications. With its compact design and advanced technology, the NCS2502DR2G is the ideal choice for those seeking high-performance amplification solutions. Experience the value and benefits that this product brings to your projects, whether you're working in industrial settings or designing innovative electronics. Choose Onsemi's NCS2502DR2G and elevate your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of PCB space and easy placement on the board.

No. of Terminals: 8

Having 8 terminals provides flexibility in circuit connections and allows for various configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves valuable board space and is suitable for compact designs.

Terminal Finish: TIN

Tin terminal finish ensures good conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting orientations and reduces PCB footprint.

Maximum Seated Height: 1.75 mm

Low seated height enables slim and compact designs, ideal for space-constrained applications.

Width: 3.9 mm

Narrow width helps in efficient space utilization on the PCB and allows for high-density layouts.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures stable solder joints during assembly and operation.

Length: 4.9 mm

Compact length contributes to a space-saving design and allows for efficient board layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Technology: BIPOLAR

Bipolar technology provides high accuracy, low noise, and wide bandwidth for precise signal processing.

Terminal Form: GULL WING

Gull wing terminal form enables easy surface mount assembly and ensures mechanical strength.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier type offers high gain, stable performance, and wide range of applications.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting and precise connections on the PCB.

Technical Specifications

Operational Amplifiers (Op Amps) NCS2502DR2G attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

NCS2502DR2G Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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