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NCP694HSAN12T1G

Onsemi

NCP694HSAN12T1G by Onsemi

NCP694HSAN12T1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 0.3A max output current, 1.2V nominal output voltage, and 85 °C max operating temperature. It is ideal for applications requiring stable voltage regulation in compact spaces due to its small outline package style and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,604 parts In-Stock

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Digiode

USA . 1,916 parts In-Stock

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Vigor

Singapore . 161 parts In-Stock

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$0.740

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AZTECH Wire

Italy . 1,212 parts In-Stock

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$20.800

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Perfect Parts

USA . 22,552 parts In-Stock

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Kulean Microsystems

USA . 5,947 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 5,924 parts In-Stock

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SupplyDigital Components

Austria . 5,595 parts In-Stock

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Problanco Electronics

Mexico . 3,736 parts In-Stock

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Kepictronics

USA . 1,605 parts In-Stock

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Corphita

USA . 1,216 parts In-Stock

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UHIMA Technologies

Türkiye . 840 parts In-Stock

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840

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TANS Electronics

Latvia . 340 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 274 parts In-Stock

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Overview

Discover the NCP694HSAN12T1G by Onsemi, a premium Fixed Regulator that combines top-notch quality with cutting-edge technology. Manufactured by the renowned Onsemi, this LDO regulator offers unmatched reliability and performance. Ideal for a wide range of applications, this product provides stable output voltage and precise regulation, ensuring optimal functionality for your electronic devices. Experience the value and benefits of the NCP694HSAN12T1G and elevate your projects to new heights with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and reliability of the product.

Maximum Dropout Voltage-1: 0.32 V

Low dropout voltage ensures efficient regulation and minimal power loss in the system.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Operating Temperature: -40 to 85 °C

Wide operating temperature range makes this regulator suitable for use in various environments and temperature conditions.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency for the regulator, leading to optimal performance.

Nominal Output Voltage-1: 1.2 V

Stable output voltage of 1.2V ensures consistent power supply to the connected components.

Maximum Output Current-1: 0.3 A

With a maximum output current of 0.3A, the regulator can handle moderate to low power requirements effectively.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP694HSAN12T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.32 V

Nominal Dropout Voltage-1:

.56 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation:

.0091 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.3 A

Minimum Output Voltage-1:

1.03 V

Nominal Output Voltage-1:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

2.8 mm

Trade Compliance

NCP694HSAN12T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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