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NCP6925AFCT2G

Onsemi

NCP6925AFCT2G by Onsemi

NCP6925AFCT2G by Onsemi is a switching regulator with 1.9A output current, 3300kHz max switching frequency, and 3.6V nominal input voltage. Ideal for industrial applications requiring precise current-mode control in a compact grid array package with very thin profile and fine pitch design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,948 parts In-Stock

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Flip Electronics

USA . 6,100 parts In-Stock

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Digiode

USA . 1,874 parts In-Stock

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AZTECH Wire

Italy . 176 parts In-Stock

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$11.230

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Perfect Parts

USA . 43,008 parts In-Stock

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Kepictronics

USA . 21,863 parts In-Stock

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Authorized Procurement Solutions

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7,500

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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Kulean Microsystems

USA . 4,176 parts In-Stock

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Corphita

USA . 2,480 parts In-Stock

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Problanco Electronics

Mexico . 2,379 parts In-Stock

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SupplyDigital Components

Austria . 2,183 parts In-Stock

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TANS Electronics

Latvia . 981 parts In-Stock

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Microchip USA

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Vigor

Singapore . 283 parts In-Stock

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UHIMA Technologies

Türkiye . 180 parts In-Stock

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Corohmni

South Africa . 101 parts In-Stock

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Overview

Elevate your power management solutions with the NCP6925AFCT2G from Onsemi. Built with precision and reliability, this switching regulator offers unparalleled performance in a compact package. Ideal for a wide range of applications, this product provides efficient voltage regulation with minimal power loss. Trust in Onsemi's reputation for excellence and innovation, and experience the value and benefits that this high-quality component brings to your projects. Unlock the potential of your designs with the NCP6925AFCT2G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB, making it suitable for compact designs.

Package Shape: SQUARE

Square package shape facilitates easier handling and placement on the board, improving overall circuit layout.

Max Operating Temperature: 85 °C

With a high maximum operating temperature, this regulator can withstand harsh industrial environments without compromising performance.

Control Mode: CURRENT-MODE

Current-mode control provides enhanced stability, efficient power conversion, and improved transient response.

Width (mm): 2.36 mm

The compact width of 2.36 mm allows for dense packing of components, ideal for space-constrained applications.

Nominal Input Voltage: 3.6 V

The 3.6 V nominal input voltage provides compatibility with a wide range of power sources, offering flexibility in design.

Max Output Current: 1.9 A

The high maximum output current of 1.9 A enables the regulator to handle demanding loads efficiently.

Max Switching Frequency: 3300 kHz

The high switching frequency of 3300 kHz allows for fast response times and reduced output ripple, improving overall performance.

Min Input Voltage: 2.5 V

The 2.5 V minimum input voltage ensures compatibility with low voltage power sources, extending the range of possible applications.

Technical Specifications

Switching Regulators & Controllers NCP6925AFCT2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

VOUT 0.6 TO 3.3V OUTPUT

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.5 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-PBGA-B36

Length:

2.36 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.6 mm

Surface Mount:

YES

Maximum Switching Frequency:

3300 kHz

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.36 mm

Trade Compliance

NCP6925AFCT2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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