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NCP584HSN18T1

Onsemi

NCP584HSN18T1 by Onsemi

NCP584HSN18T1 by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 1.8V and max dropout voltage of 0.3V, suitable for applications requiring low profile and small outline packages. It has a max output current of 0.2A, operating temperature range from -40 to 85 °C, and can accept input voltages ranging from 1.4V to 6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,107 parts In-Stock

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Digiode

USA . 2,027 parts In-Stock

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AZTECH Wire

Italy . 770 parts In-Stock

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$18.860

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770

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Kulean Microsystems

USA . 8,326 parts In-Stock

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TANS Electronics

Latvia . 8,026 parts In-Stock

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SupplyDigital Components

Austria . 4,663 parts In-Stock

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Corphita

USA . 2,491 parts In-Stock

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UHIMA Technologies

Türkiye . 739 parts In-Stock

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Corohmni

South Africa . 396 parts In-Stock

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Vigor

Singapore . 179 parts In-Stock

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Microchip USA

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Problanco Electronics

Mexico . 143 parts In-Stock

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Overview

Elevate your electronic devices with the NCP584HSN18T1 by Onsemi, a high-quality fixed regulator that guarantees reliable performance and durability. Manufactured by Onsemi, a trusted name in the industry, this product is designed to meet the demanding needs of various applications. With its compact size and low profile package, it offers convenience and flexibility in installation. Say goodbye to voltage fluctuations and power disruptions as this regulator ensures stable output voltage with minimal dropout. Trust Onsemi's expertise and invest in the NCP584HSN18T1 for seamless operation and enhanced efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material allows for a lightweight and durable design, making the product easy to handle and long-lasting.

Maximum Dropout Voltage: 1.3 V

With a low dropout voltage, this regulator ensures a stable output even when the input voltage fluctuates, providing reliable power supply.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB, making it suitable for compact designs.

Operating Temperature: -40 to 85 °C

Wide operating temperature range ensures the regulator can perform in various environmental conditions, making it versatile and reliable.

Nominal Output Voltage: 1.8 V

The consistent output voltage ensures that the connected components receive the correct power supply, preventing damage and ensuring proper functionality.

Maximum Output Current: 0.2 A

Ability to deliver a decent output current ensures compatibility with a wide range of devices and components, making it a versatile choice.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP584HSN18T1 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.3 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

2.9 mm

No. of Functions:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Maximum Output Voltage-1:

1.854 V

Minimum Output Voltage-1:

1.746 V

Nominal Output Voltage-1:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification Status:

Not Qualified

Maximum Seated Height:

1.4 mm

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

1.65 mm

Trade Compliance

NCP584HSN18T1 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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