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NCP584HSN18T1G

Onsemi

NCP584HSN18T1G by Onsemi

NCP584HSN18T1G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 1.8V and max output current of 0.25A. It operates in an extended temperature range from -40°C to 125°C, making it suitable for various applications requiring stable voltage regulation in compact designs. The package style is small outline, low profile, shrink pitch, ideal for space-constrained PCB layouts.

Median Price

$0.938

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Bristol Electronics

USA . 2,767 parts In-Stock

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$0.938

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$0.347

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$0.244

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Chip Stock

USA . 72,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Vyrian

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Digiode

USA . 1,372 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Vigor

Singapore . 216 parts In-Stock

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$0.230

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Ampacity Inc.

Singapore . 1,095 parts In-Stock

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$10.500

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AZTECH Wire

Italy . 641 parts In-Stock

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$15.451

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Problanco Electronics

Mexico . 7,266 parts In-Stock

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Kulean Microsystems

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RC Electronics

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SupplyDigital Components

Austria . 5,294 parts In-Stock

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GreenTree Electronics

Israel . 4,270 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Perfect Parts

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Assy Fe

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Continental Prestige Electronics

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Corphita

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Bastille Electronics

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TANS Electronics

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Argo Parts USA

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Microchip USA

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Corohmni

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Overview

Discover the NCP584HSN18T1G by Onsemi, a top-quality Fixed Regulator that guarantees reliable performance and precise output voltage. Manufactured by Onsemi, a trusted brand known for its cutting-edge technology and innovative solutions, this LDO regulator is ideal for a wide range of applications. With a low dropout voltage and excellent line and load regulation, this product offers customers unparalleled value, ensuring stable power delivery for their projects. Invest in the NCP584HSN18T1G today and experience the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Maximum Dropout Voltage-1: 1.3 V

With a low dropout voltage, this regulator is efficient and minimizes power loss.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on a PCB.

Operating Temperature (TJ-Max): 125 °C

The high operating temperature range ensures reliable performance in various environments.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and fits well in compact designs.

Terminal Form: GULL WING

The gull wing terminal form provides strong and reliable connections.

Operating Temperature (TJ-Min): -40 °C

The low operating temperature range makes this regulator suitable for extreme cold conditions.

Packing Method: TR

The tape reel packaging method allows for automated manufacturing processes.

Minimum Output Voltage-1: 1.746 V

The minimum output voltage ensures compatibility with a wide range of applications.

Maximum Voltage Tolerance: 3 %

The tight voltage tolerance ensures stable and accurate output voltage.

Nominal Output Voltage-1: 1.8 V

The nominal output voltage meets the standard requirements for many electronic devices.

No. of Terminals: 5

The 5 terminals provide easy connectivity and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The compact and low-profile package style saves space and allows for dense PCB layouts.

Adjustability: FIXED

The fixed output eliminates the need for external calibration and simplifies circuit design.

Terminal Pitch: 0.95 mm

The small terminal pitch enables high-density mounting on a PCB.

Maximum Line Regulation: 0.02 %

The low line regulation ensures stable output voltage under varying input conditions.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

This regulator provides a reliable and stable output voltage for various applications.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and design.

Maximum Output Voltage-1: 1.854 V

The maximum output voltage ensures compatibility with different voltage requirements.

Maximum Seated Height: 1.4 mm

The low seated height allows for compact and space-saving designs.

Width: 1.65 mm

The narrow width of the regulator enables placement in tight spaces.

Maximum Load Regulation: 0.04 %

The low load regulation ensures stable output voltage under varying current loads.

Minimum Input Voltage: 1.4 V

The low minimum input voltage allows for operation in low-power applications.

Maximum Output Current-1: 0.25 A

The high output current rating makes this regulator suitable for powering a variety of electronic components.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures proper soldering without damaging the components.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability makes this regulator suitable for lead-free soldering processes.

Nominal Dropout Voltage-1: 0.5 V

The low dropout voltage ensures efficient power conversion and minimal power loss.

Length: 2.9 mm

The compact length of the regulator allows for placement in tight spaces on a PCB.

Maximum Input Voltage: 6 V

The high input voltage rating provides flexibility for various power supply configurations.

Maximum Input Voltage Absolute: 6.5 V

The absolute maximum input voltage ensures protection against voltage spikes and surges.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP584HSN18T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.3 V

Nominal Dropout Voltage-1:

.5 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation:

.02 %

Maximum Load Regulation:

.04 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.25 A

Maximum Output Voltage-1:

1.854 V

Minimum Output Voltage-1:

1.746 V

Nominal Output Voltage-1:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.65 mm

Trade Compliance

NCP584HSN18T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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