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NCP5501DT33G

Onsemi

NCP5501DT33G by Onsemi

NCP5501DT33G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.5A. It has a small outline package style, operates b/w -40 to 85°C, and is suitable for applications requiring low dropout voltage and precise voltage regulation.

Median Price

$0.214

Lifecycle Status

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8

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1k+

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Nova Conductors

Japan . 45 parts In-Stock

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Corohmni

South Africa . 234 parts In-Stock

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Continental Prestige Electronics

USA . 5,538 parts In-Stock

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Argo Parts USA

USA . 4,827 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Vigor

Singapore . 945 parts In-Stock

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Ampacity Inc.

Singapore . 868 parts In-Stock

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AZTECH Wire

Italy . 596 parts In-Stock

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iodParts Technologies Inc.

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Overview

Discover the NCP5501DT33G by Onsemi, a top-tier fixed regulator that guarantees reliable performance and efficiency. With a solid reputation for high-quality products, Onsemi delivers cutting-edge technology in the form of this Positive Single Output LDO regulator. Ideal for a wide range of applications, this regulator offers customers unparalleled value with its stable output voltage, minimal dropout voltage, and excellent load regulation. Trust Onsemi to provide the innovation and reliability you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the regulator.

Maximum Dropout Voltage-1: 1.7 V

Allows for reliable performance even when there is a small difference between input and output voltages.

Surface Mount: YES

Enables easy and efficient PCB assembly.

Operating Temperature (TJ-Max): 150 °C

Can operate in high temperature environments without compromising performance.

Technology: BIPOLAR

Offers stable and accurate output voltage regulation.

Nominal Output Voltage-1: 3.3 V

Provides a consistent output voltage for powering various electronic devices.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

Helps in efficient heat dissipation to maintain optimal operation.

Adjustability: FIXED

Eliminates the need for manual adjustments, ensuring a hassle-free setup.

Maximum Output Current-1: 0.5 A

Sufficient to power low to moderately demanding electronic circuits.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP5501DT33G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.7 V

Nominal Dropout Voltage-1:

.23 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

16 V

Minimum Input Voltage:

4 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.54 mm

Maximum Line Regulation:

.033 %

Maximum Load Regulation:

.033 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

150 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

3.462 V

Minimum Output Voltage-1:

3.138 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

6.095 mm

Trade Compliance

NCP5501DT33G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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