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NCP4688DMU33TCG

Onsemi

NCP4688DMU33TCG by Onsemi

NCP4688DMU33TCG by Onsemi is a CMOS LDO regulator with 3.3V output voltage, 0.28V dropout, and 0.15A output current. Ideal for applications requiring stable power supply in compact spaces due to its small outline package style and low load regulation of 0.014%.

Median Price

$0.418

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 226,769 parts In-Stock

1+ parts

-

100+ parts

$0.412

1k+ parts

$0.342

10k+ parts

$0.305

226,769

-

$0.412

$0.342

$0.305

Verical

USA . 168,297 parts In-Stock

1+ parts

-

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$0.425

10k+ parts

$0.379

168,297

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-

$0.425

$0.379

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 761 parts In-Stock

1+ parts

$0.319

100+ parts

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761

$0.319

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Vyrian

USA . 2,150 parts In-Stock

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2,150

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Distributors (Availability)

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Corphita

USA . 1,798 parts In-Stock

1+ parts

$0.302

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-

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1,798

$0.302

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Corohmni

South Africa . 213 parts In-Stock

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$0.336

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213

$0.336

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AZTECH Wire

Italy . 309 parts In-Stock

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$13.230

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309

$13.230

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Continental Prestige Electronics

USA . 226,772 parts In-Stock

1+ parts

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$0.285

226,772

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$0.285

QUARKTWIN TECHNOLOGY LTD

USA . 17,035 parts In-Stock

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17,035

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Problanco Electronics

Mexico . 5,652 parts In-Stock

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5,652

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SupplyDigital Components

Austria . 5,319 parts In-Stock

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5,319

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Kulean Microsystems

USA . 3,046 parts In-Stock

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3,046

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TANS Electronics

Latvia . 938 parts In-Stock

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938

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Microchip USA

USA . 354 parts In-Stock

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354

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UHIMA Technologies

Türkiye . 84 parts In-Stock

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84

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Overview

Experience seamless power regulation with the NCP4688DMU33TCG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. This Fixed Regulator - Positive Single Output LDO is versatile and perfect for a wide range of applications. Enjoy the benefits of precise voltage control, low dropout voltage, and high efficiency, making it an ideal choice for your electronic projects. Trust Onsemi to provide you with superior performance and value with the NCP4688DMU33TCG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ensuring long-lasting performance.

Maximum Dropout Voltage-1: 1.28 V

Low dropout voltage ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Easy installation on circuit boards, saving time and effort in assembly.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers high power efficiency and low noise, ideal for sensitive electronic applications.

Package Shape: SQUARE

Square shape allows for space-efficient design and optimal placement on PCBs.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance for long-term reliability.

Maximum Output Current-1: 0.15 A

Sufficient output current for powering typical electronic components in various applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4688DMU33TCG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.28 V

Nominal Dropout Voltage-1:

.2 V

Maximum Input Voltage:

5.25 V

Minimum Input Voltage:

2 V

JESD-30 Code:

S-PDSO-N4

JESD-609 Code:

e3

Length:

1 mm

Maximum Load Regulation:

.014 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.3495 V

Minimum Output Voltage-1:

3.2505 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.6 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

Width:

1 mm

Trade Compliance

NCP4688DMU33TCG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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