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NCP4687DMX33TCG

Onsemi

NCP4687DMX33TCG by Onsemi

NCP4687DMX33TCG by Onsemi is a Fixed Positive Single Output LDO Regulator with 3.3V Nominal Output Voltage, 0.5A Max Output Current, and 1.5% Max Voltage Tolerance. It is ideal for applications requiring stable voltage regulation in compact electronic devices due to its small outline package style and low dropout voltage of 0.22V.

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1k+

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Vyrian

USA . 5,991 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 71 parts In-Stock

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$8.420

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Component Stockers USA

USA . 269 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 7,240 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,013 parts In-Stock

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Problanco Electronics

Mexico . 4,991 parts In-Stock

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Kulean Microsystems

USA . 3,193 parts In-Stock

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Corphita

USA . 871 parts In-Stock

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UHIMA Technologies

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SupplyDigital Components

Austria . 507 parts In-Stock

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South Africa . 497 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic devices with the NCP4687DMX33TCG by Onsemi, a top-of-the-line Fixed Regulator known for its reliability and precision. Manufactured by industry leader Onsemi, this LDO regulator ensures stable output voltage, making it ideal for a wide range of applications. With superior performance and high efficiency, this product offers customers unbeatable value and unmatched benefits. Upgrade your electronics today with the NCP4687DMX33TCG and experience the difference in quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the regulator long-lasting and reliable.

Maximum Dropout Voltage: 1.32 V

Low dropout voltage ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Ease of installation and compact size make it suitable for space-constrained applications.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range allows for use in different environments without performance degradation.

Technology: CMOS

CMOS technology offers high efficiency and low power consumption.

Minimum Output Voltage: 3.2505 V

Stable output voltage provides a reliable power source for connected devices.

Nominal Output Voltage: 3.3 V

Precise output voltage regulation ensures consistent performance of connected devices.

Maximum Voltage Tolerance: 1.5 %

Tight voltage tolerance ensures accurate power delivery to sensitive electronics.

Nominal Dropout Voltage: 0.22 V

Low dropout voltage improves efficiency and reduces heat dissipation.

Maximum Output Current: 0.5 A

Adequate output current capability supports a wide range of electronic devices.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4687DMX33TCG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.32 V

Nominal Dropout Voltage-1:

.22 V

Maximum Input Voltage:

5.25 V

Minimum Input Voltage:

4.3 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Maximum Load Regulation:

.02 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

3.3495 V

Minimum Output Voltage-1:

3.2505 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

1.2 mm

Trade Compliance

NCP4687DMX33TCG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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