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NCP4687DMX25TCG

Onsemi

NCP4687DMX25TCG by Onsemi

NCP4687DMX25TCG by Onsemi is a Fixed Positive Single Output LDO Regulator with 2.5V Nominal Output Voltage, 0.34V Max Dropout Voltage, and 0.5A Max Output Current. Ideal for applications requiring stable voltage regulation in compact spaces with operating temperatures ranging from -40 to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,158 parts In-Stock

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Digiode

USA . 471 parts In-Stock

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471

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AZTECH Wire

Italy . 233 parts In-Stock

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$10.510

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A-Z Elektronik GmbH

Germany . 7,374 parts In-Stock

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Problanco Electronics

Mexico . 6,079 parts In-Stock

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SupplyDigital Components

Austria . 5,705 parts In-Stock

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TANS Electronics

Latvia . 5,127 parts In-Stock

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Corphita

USA . 1,616 parts In-Stock

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Kulean Microsystems

USA . 1,535 parts In-Stock

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UHIMA Technologies

Türkiye . 780 parts In-Stock

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Microchip USA

USA . 412 parts In-Stock

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Corohmni

South Africa . 387 parts In-Stock

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Overview

Discover the NCP4687DMX25TCG by Onsemi, a top-quality Fixed Regulator that offers reliable performance and precise voltage output. Manufactured by Onsemi, a trusted name in the industry known for superior products, this LDO regulator is perfect for a wide range of applications. With a compact design and high efficiency, this product ensures stable power supply with minimal dropout voltage. Experience the value and benefits of the NCP4687DMX25TCG, providing customers with a dependable solution for their power regulation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and reliability for the product

Maximum Dropout Voltage: 1.34 V

Efficiently regulates output voltage even when input voltage is close to output voltage

Surface Mount: YES

Easily mountable on circuit boards for streamlined integration

Operating Temperature (TJ-Max): 150 °C

Ensures stable performance even in high temperature environments

Technology: CMOS

Provides efficient power regulation with low power consumption

Minimum Output Voltage: 2.4625 V

Maintains a stable output voltage above the minimum required level

Nominal Output Voltage: 2.5 V

Provides a steady output voltage within a close tolerance range

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for efficient manufacturing processes

Maximum Output Current: 0.5 A

Capable of supplying sufficient current for various applications

Maximum Input Voltage: 5.25 V

Wide input voltage range allows for versatility in power supply options

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4687DMX25TCG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.34 V

Nominal Dropout Voltage-1:

.23 V

Maximum Input Voltage:

5.25 V

Minimum Input Voltage:

3.5 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Maximum Load Regulation:

.02 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

2.5375 V

Minimum Output Voltage-1:

2.4625 V

Nominal Output Voltage-1:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

1.2 mm

Trade Compliance

NCP4687DMX25TCG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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