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NCP4687DH33T1G

Onsemi

NCP4687DH33T1G by Onsemi

NCP4687DH33T1G by Onsemi is a 3.3V Fixed Positive Single Output LDO Regulator with 0.5A output current, 1.5% voltage tolerance, and 0.02% load regulation. It is ideal for applications requiring stable voltage supply in compact electronic devices due to its small outline package style and low profile design.

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1k+

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Vyrian

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Digiode

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AZTECH Wire

Italy . 482 parts In-Stock

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$8.950

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Component Stockers USA

USA . 645 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,539 parts In-Stock

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TANS Electronics

Latvia . 7,498 parts In-Stock

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Problanco Electronics

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Corphita

USA . 1,376 parts In-Stock

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UHIMA Technologies

Türkiye . 482 parts In-Stock

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Kulean Microsystems

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Vigor

Singapore . 235 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of reliable voltage regulation with the NCP4687DH33T1G by Onsemi. Manufactured by a trusted industry leader, this fixed positive single output LDO regulator offers superior quality and performance for various applications. With a compact design and high efficiency, this product ensures stability and precision in voltage output, making it an essential component for your electronic devices. Experience seamless operation and peace of mind with the NCP4687DH33T1G, providing you with the value and benefits you need to take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and heat resistance, making it suitable for a wide range of applications.

Maximum Dropout Voltage-1: 0.32 V

Low maximum dropout voltage ensures efficient voltage regulation and minimal power loss.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Operating Temperature (TJ-Max): 150 °C

High maximum operating temperature ensures reliability in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the regulator efficient and reliable.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on circuit boards.

Terminal Form: FLAT

Flat terminal form ensures secure and stable connections in the circuit.

Operating Temperature (TJ-Min): -40 °C

Low minimum operating temperature enables operation in cold environments without issues.

Minimum Output Voltage-1: 3.2505 V

Precise minimum output voltage ensures stability in power output.

Maximum Voltage Tolerance: 1.5 %

Tight voltage tolerance ensures accurate voltage regulation for sensitive components.

Nominal Output Voltage-1: 3.3 V

Stable nominal output voltage meets common voltage requirements in many applications.

No. of Terminals: 5

Sufficient number of terminals for essential connections and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Compact and low-profile package style with added heat sink capacity for improved thermal performance.

Terminal Pitch: 1.5 mm

Optimal terminal pitch for easy soldering and connection to circuit boards.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Specifically designed as a low dropout voltage regulator for stable positive voltage output.

Terminal Finish: TIN

Tin terminal finish ensures good conductivity and reliable long-term performance.

Terminal Position: DUAL

Dual terminal position provides redundancy and additional stability in connections.

Maximum Output Voltage-1: 3.3495 V

Precise maximum output voltage meets voltage requirements for various electronic components.

Maximum Seated Height: 1.6 mm

Low maximum seated height allows for compact and space-efficient circuit board design.

Width: 2.5 mm

Narrow width enables placement in tight spaces on the circuit board.

Maximum Load Regulation: 0.02 %

Very low load regulation ensures stable voltage output under varying load conditions.

Minimum Input Voltage: 4.3 V

Suitable minimum input voltage for reliable operation in various power supply configurations.

Maximum Output Current-1: 0.5 A

High maximum output current capability for driving power-hungry components.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature for efficient and precise soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable solder joints.

Nominal Dropout Voltage-1: 0.22 V

Low nominal dropout voltage ensures efficient and stable performance under varying load conditions.

Length: 4.5 mm

Compact length for space-saving installation on the circuit board.

Maximum Input Voltage: 5.25 V

Safe maximum input voltage for protection against overvoltage conditions.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4687DH33T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.32 V

Nominal Dropout Voltage-1:

.22 V

Maximum Input Voltage:

5.25 V

Minimum Input Voltage:

4.3 V

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

4.5 mm

Maximum Load Regulation:

.02 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

3.3495 V

Minimum Output Voltage-1:

3.2505 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

2.5 mm

Trade Compliance

NCP4687DH33T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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