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NCP4687DH25T1G

Onsemi

NCP4687DH25T1G by Onsemi

NCP4687DH25T1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 2.5V Nominal Output Voltage, 0.5A Max Output Current, and 1.6mm Max Seated Height. It is ideal for applications requiring low dropout voltage and precise voltage regulation in compact electronic devices.

Median Price

$0.359

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 565 parts In-Stock

1+ parts

-

100+ parts

$0.359

1k+ parts

$0.298

10k+ parts

$0.265

565

-

$0.359

$0.298

$0.265

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,600 parts In-Stock

1+ parts

$0.365

100+ parts

-

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1,600

$0.365

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Vyrian

USA . 5,061 parts In-Stock

1+ parts

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5,061

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Chip Stock

USA . 4,362 parts In-Stock

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4,362

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Distributors (Availability)

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Vigor

Singapore . 640 parts In-Stock

1+ parts

$0.280

100+ parts

-

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640

$0.280

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Corphita

USA . 2,235 parts In-Stock

1+ parts

$0.346

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2,235

$0.346

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Corohmni

South Africa . 446 parts In-Stock

1+ parts

$0.384

100+ parts

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446

$0.384

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AZTECH Wire

Italy . 1,033 parts In-Stock

1+ parts

$11.620

100+ parts

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1,033

$11.620

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TANS Electronics

Latvia . 8,120 parts In-Stock

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8,120

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Kulean Microsystems

USA . 7,684 parts In-Stock

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7,684

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Problanco Electronics

Mexico . 4,890 parts In-Stock

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4,890

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SupplyDigital Components

Austria . 1,925 parts In-Stock

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1,925

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UHIMA Technologies

Türkiye . 167 parts In-Stock

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167

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Microchip USA

USA . 138 parts In-Stock

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138

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Overview

Discover the NCP4687DH25T1G by Onsemi, a top-quality fixed regulator that offers reliable performance and precise voltage regulation. With Onsemi's reputation for excellence in manufacturing, this LDO is perfect for a wide range of applications, providing stable power output with minimal dropout voltage. From consumer electronics to industrial equipment, this product ensures optimal efficiency and protection for your devices. Trust in the value and benefits of the NCP4687DH25T1G for all your power supply needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the regulator.

Maximum Dropout Voltage: 1.34 V

Low dropout voltage ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, making it suitable for compact designs.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high efficiency.

Operating Temperature (TJ-Max): 150 °C

Can operate at high temperatures without performance degradation, suitable for industrial applications.

Nominal Output Voltage: 2.5 V

Provides a stable output voltage for powering various components in electronic devices.

Maximum Output Current: 0.5 A

Capable of delivering up to 0.5 amps of current, suitable for powering a range of electronic devices.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4687DH25T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.34 V

Nominal Dropout Voltage-1:

.23 V

Maximum Input Voltage:

5.25 V

Minimum Input Voltage:

3.5 V

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

4.5 mm

Maximum Load Regulation:

.02 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

2.5375 V

Minimum Output Voltage-1:

2.4625 V

Nominal Output Voltage-1:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

2.5 mm

Trade Compliance

NCP4687DH25T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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