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NCP4686DSN08T1G

Onsemi

NCP4686DSN08T1G by Onsemi

NCP4686DSN08T1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 0.4A max output current, 1V min input voltage, and 150 °C max operating temperature. Ideal for applications requiring low dropout voltage and precise voltage regulation in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,277 parts In-Stock

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4,277

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Digiode

USA . 132 parts In-Stock

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132

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AZTECH Wire

Italy . 1,169 parts In-Stock

1+ parts

$19.750

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1,169

$19.750

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TANS Electronics

Latvia . 8,301 parts In-Stock

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Kulean Microsystems

USA . 4,551 parts In-Stock

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Problanco Electronics

Mexico . 2,339 parts In-Stock

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Corphita

USA . 2,206 parts In-Stock

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SupplyDigital Components

Austria . 2,133 parts In-Stock

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Vigor

Singapore . 499 parts In-Stock

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499

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Microchip USA

USA . 427 parts In-Stock

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UHIMA Technologies

Türkiye . 223 parts In-Stock

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Corohmni

South Africa . 174 parts In-Stock

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Overview

Enhance your electronic designs with the NCP4686DSN08T1G by Onsemi, a top-tier manufacturer renowned for its superior quality and innovation. This Fixed Regulator - Positive Single Output LDO offers reliability and efficiency, making it perfect for a wide range of applications. Experience the seamless performance and unparalleled value that this product brings, providing customers with unmatched benefits and advantages in their projects. Elevate your creations with Onsemi's cutting-edge technology embodied in the NCP4686DSN08T1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for the product.

Maximum Dropout Voltage-1: 1.54 V

Low dropout voltage ensures efficient power regulation even with small input-output differentials.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range makes this regulator suitable for various environments and applications.

Technology: CMOS

CMOS technology offers high efficiency and low power consumption, making it an energy-efficient choice.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts and designs.

Terminal Form: GULL WING

Gull wing terminals offer strong mechanical support and secure connection points.

Operating Temperature (TJ-Min): -40 °C

Wide temperature range ensures reliable performance even in extreme cold conditions.

Minimum Output Voltage-1: 1.783 V

Stable minimum output voltage ensures consistent power delivery to the load.

Maximum Voltage Tolerance: 1.7%

Tight voltage tolerance ensures precise output voltage regulation for sensitive electronic components.

Nominal Output Voltage-1: 1.8 V

Stable nominal output voltage ensures reliable operation for connected devices.

No. of Terminals: 5

Sufficient number of terminals for easy integration into circuit designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact package style with low profile design saves space on the PCB and allows for efficient heat dissipation.

Adjustability: FIXED

Fixed output voltage eliminates the need for external adjustment components, simplifying the design.

Terminal Pitch: 0.95 mm

Close terminal pitch allows for compact placement on the PCB, saving valuable board space.

Maximum Line Regulation: 0.0046%

Low line regulation ensures stable output voltage despite fluctuations in input voltage.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Fixed positive output regulator with low dropout ensures stable and reliable power supply for sensitive electronics.

Terminal Finish: TIN

Tin terminal finish provides corrosion resistance and low contact resistance for reliable connectivity.

Terminal Position: DUAL

Dual terminal position enhances mechanical stability and ensures secure mounting on the PCB.

Maximum Output Voltage-1: 1.817 V

High maximum output voltage ensures compatibility with a wide range of applications.

Maximum Seated Height: 1.45 mm

Low seated height allows for compact design and efficient heat dissipation.

Width: 1.65 mm

Narrow width allows for placement in tight spaces on the PCB, maximizing board real estate.

Maximum Load Regulation: 0.045%

Low load regulation ensures stable output voltage under varying load conditions, providing consistent power supply to connected devices.

Minimum Input Voltage: 1 V

Low minimum input voltage requirement allows for operation in low-power scenarios.

Maximum Output Current-1: 0.4 A

High output current capability enables the regulator to power a wide range of devices and components.

Maximum Time At Peak Reflow Temperature (s): 30

Extended reflow time at peak temperature ensures secure solder joints and reliable connections during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures compatibility with standard reflow soldering processes.

Nominal Dropout Voltage-1: 1.4 V

Low dropout voltage helps minimize power loss and heat dissipation, improving energy efficiency.

Length: 2.9 mm

Compact length allows for flexible placement options on the PCB and efficient use of board space.

Maximum Input Voltage: 3.6 V

High maximum input voltage tolerance provides flexibility for various power supply configurations.

Maximum Input Voltage Absolute: 4 V

Wide absolute input voltage range ensures compatibility with a wide range of power sources.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4686DSN08T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.54 V

Nominal Dropout Voltage-1:

.4 V

Maximum Input Voltage Absolute:

4 V

Maximum Input Voltage:

3.6 V

Minimum Input Voltage:

1 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation:

.0046 %

Maximum Load Regulation:

.045 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.4 A

Maximum Output Voltage-1:

.817 V

Minimum Output Voltage-1:

.783 V

Nominal Output Voltage-1:

.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

1.65 mm

Trade Compliance

NCP4686DSN08T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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