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NCP4683DMU31TCG

Onsemi

NCP4683DMU31TCG by Onsemi

NCP4683DMU31TCG by Onsemi is a CMOS LDO regulator with 3.1V output voltage, 0.3A output current, and 0.29V dropout voltage. It is ideal for applications requiring stable power supply in compact spaces due to its small outline package style and very thin profile design.

Median Price

$0.444

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 87,500 parts In-Stock

1+ parts

-

100+ parts

$0.436

1k+ parts

$0.362

10k+ parts

$0.323

87,500

-

$0.436

$0.362

$0.323

Verical

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.452

10k+ parts

$0.403

40,000

-

-

$0.452

$0.403

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,311 parts In-Stock

1+ parts

$0.339

100+ parts

-

1k+ parts

-

10k+ parts

-

2,311

$0.339

-

-

-

Vyrian

USA . 4,785 parts In-Stock

1+ parts

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4,785

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,085 parts In-Stock

1+ parts

$0.321

100+ parts

-

1k+ parts

-

10k+ parts

-

2,085

$0.321

-

-

-

Corohmni

South Africa . 176 parts In-Stock

1+ parts

$0.351

100+ parts

-

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10k+ parts

-

176

$0.351

-

-

-

AZTECH Wire

Italy . 1,199 parts In-Stock

1+ parts

$15.060

100+ parts

-

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1,199

$15.060

-

-

-

Continental Prestige Electronics

USA . 87,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.303

87,500

-

-

-

$0.303

TANS Electronics

Latvia . 7,718 parts In-Stock

1+ parts

-

100+ parts

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7,718

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Kulean Microsystems

USA . 6,365 parts In-Stock

1+ parts

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6,365

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SupplyDigital Components

Austria . 6,074 parts In-Stock

1+ parts

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100+ parts

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6,074

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Problanco Electronics

Mexico . 1,052 parts In-Stock

1+ parts

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1,052

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UHIMA Technologies

Türkiye . 846 parts In-Stock

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846

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Microchip USA

USA . 108 parts In-Stock

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108

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Overview

Experience superior power regulation with the NCP4683DMU31TCG by Onsemi. This fixed positive single output LDO regulator offers a reliable solution for a wide range of applications. With Onsemi's reputation for excellence in semiconductor manufacturing, you can trust in the quality and performance of this product. Enjoy the benefits of precise voltage regulation, low dropout voltage, and efficient power management. Upgrade your electronic designs with the NCP4683DMU31TCG and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and heat resistance, making the product suitable for a wide range of applications.

Operating Temperature (TJ-Max): 150 °C

Allows the regulator to operate efficiently even in high-temperature environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the regulator energy-efficient and reliable.

Minimum Output Voltage-1: 3.007 V

Ensures a stable output voltage even under varying load conditions.

Nominal Output Voltage-1: 3.1 V

Provides a consistent and reliable output voltage for powered devices.

Terminal Pitch: 0.65 mm

Compact terminal pitch allows for easy integration into tight spaces and small circuit designs.

Maximum Output Current-1: 0.3 A

Capable of providing a sufficient amount of current to power various electronic components.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4683DMU31TCG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.29 V

Nominal Dropout Voltage-1:

.22 V

Maximum Input Voltage:

5.25 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

S-PDSO-N4

JESD-609 Code:

e3

Length:

1 mm

Maximum Load Regulation:

.04 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Voltage-1:

3.193 V

Minimum Output Voltage-1:

3.007 V

Nominal Output Voltage-1:

3.1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.6 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

3 %

Width:

1 mm

Trade Compliance

NCP4683DMU31TCG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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