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NCP4681DSQ33T1G

Onsemi

NCP4681DSQ33T1G by Onsemi

NCP4681DSQ33T1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 3.3V Nominal Output Voltage, 0.15A Max Output Current, and 0.35V Max Dropout Voltage. It is ideal for applications requiring stable voltage regulation in compact electronic devices due to its small outline package style and low dropout voltage.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 9,371 parts In-Stock

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$0.300

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$0.270

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$0.270

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Vyrian

USA . 3,611 parts In-Stock

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Semtec, LLC

USA . 2,971 parts In-Stock

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Digiode

USA . 1,417 parts In-Stock

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Vigor

Singapore . 359 parts In-Stock

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$0.270

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359

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Corohmni

South Africa . 271 parts In-Stock

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AZTECH Wire

Italy . 244 parts In-Stock

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$12.290

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Continental Prestige Electronics

USA . 12,643 parts In-Stock

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$0.239

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Problanco Electronics

Mexico . 8,295 parts In-Stock

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Kulean Microsystems

USA . 7,075 parts In-Stock

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Perfect Parts

USA . 3,748 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,583 parts In-Stock

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TANS Electronics

Latvia . 2,633 parts In-Stock

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SupplyDigital Components

Austria . 1,473 parts In-Stock

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UHIMA Technologies

Türkiye . 909 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Microchip USA

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Corphita

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Overview

Upgrade your electronic devices with the NCP4681DSQ33T1G by Onsemi, a top-tier manufacturer known for their reliable and high-quality components. This Fixed Positive Single Output LDO Regulator offers stable and precise voltage regulation, ensuring optimal performance in various applications. With a small outline package and surface mount technology, this regulator is not only efficient but also easy to integrate into your designs. Trust Onsemi to deliver superior products that guarantee long-term reliability and exceptional value for your projects. Elevate your electronics with the NCP4681DSQ33T1G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the regulator easy to handle and suitable for a variety of applications.

Maximum Dropout Voltage: 1.35 V

Low dropout voltage ensures efficient power regulation even when the input voltage is close to the output voltage, maximizing the device's performance.

Surface Mount: YES

Surface mount capability allows for easy and cost-effective assembly onto circuit boards, saving space and reducing manufacturing complexity.

Operating Temperature (TJ-Max): 150 °C

High maximum operating temperature range ensures reliable performance in a wide range of environmental conditions, making it suitable for various industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the regulator efficient and reliable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and integration onto circuit boards, facilitating a streamlined design process.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring a secure connection for optimal performance.

Operating Temperature (TJ-Min): -40 °C

Low minimum operating temperature ensures functionality even in harsh environments with extreme cold conditions, increasing the regulator's versatility.

Nominal Output Voltage: 3.3 V

Stable nominal output voltage ensures consistent power supply to connected devices, promoting reliable operation and performance.

Maximum Output Current: 0.15 A

High maximum output current capacity allows for powering a range of electronic components or circuits, making it suitable for diverse applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4681DSQ33T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.35 V

Nominal Dropout Voltage-1:

.28 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.25 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Maximum Line Regulation:

.004 %

Maximum Load Regulation:

.02 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.3825 V

Minimum Output Voltage-1:

3.201 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

Width:

1.25 mm

Trade Compliance

NCP4681DSQ33T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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