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NCP4625DSN50T1G

Onsemi

NCP4625DSN50T1G by Onsemi

NCP4625DSN50T1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.3A Max Output Current, and 1% Max Voltage Tolerance. It is ideal for applications requiring stable voltage regulation in compact spaces due to its small outline thin profile package style.

Median Price

$0.362

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 406 parts In-Stock

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$0.362

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406

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Vyrian

USA . 3,974 parts In-Stock

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3,974

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Digiode

USA . 1,211 parts In-Stock

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EMSNET

USA . 5 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 933 parts In-Stock

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$0.350

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933

$0.350

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Corohmni

South Africa . 439 parts In-Stock

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$0.362

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439

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AZTECH Wire

Italy . 504 parts In-Stock

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$14.740

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Perfect Parts

USA . 28,382 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 11,528 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,660 parts In-Stock

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Problanco Electronics

Mexico . 4,717 parts In-Stock

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Kulean Microsystems

USA . 4,211 parts In-Stock

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SupplyDigital Components

Austria . 2,313 parts In-Stock

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TANS Electronics

Latvia . 1,755 parts In-Stock

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Corphita

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 792 parts In-Stock

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Continental Prestige Electronics

USA . 406 parts In-Stock

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$0.312

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406

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Microchip USA

USA . 385 parts In-Stock

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385

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Overview

Enhance your electronic devices with the NCP4625DSN50T1G by Onsemi, a top-quality single output LDO fixed regulator. Manufactured with precision and reliability in mind, this product offers a seamless voltage regulation experience with minimal dropout voltage. Perfect for various applications, this regulator ensures optimal performance, stability, and efficiency. Trust Onsemi to deliver exceptional products that bring value and benefits to your projects. Elevate your designs with the NCP4625DSN50T1G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to damage, ensuring the longevity and reliability of the regulator.

Maximum Dropout Voltage-1: 1.75 V

The low dropout voltage allows the regulator to operate efficiently even when the input voltage is close to the output voltage, making it suitable for applications where tight voltage regulation is required.

Surface Mount: YES

The surface mount feature makes it easy to solder the regulator onto a PCB, saving space and simplifying the assembly process.

Operating Temperature (TJ-Max): 150 °C

The wide operating temperature range of up to 150 °C ensures that the regulator can perform reliably in high-temperature environments, making it suitable for industrial and automotive applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and alignment on the PCB, improving the overall aesthetic and functionality of the design.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable connection to the PCB, reducing the risk of disconnection or signal interference.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4625DSN50T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.75 V

Nominal Dropout Voltage-1:

.5 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

10 V

Minimum Input Voltage:

5.5 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation:

.045 %

Maximum Load Regulation:

.07 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Voltage-1:

5.05 V

Minimum Output Voltage-1:

4.95 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.45 mm

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

1 %

Width:

1.65 mm

Trade Compliance

NCP4625DSN50T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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