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NCP1339HDR2G

Onsemi

NCP1339HDR2G by Onsemi

NCP1339HDR2G by Onsemi is a current-mode switching controller with 13 terminals, operating b/w -40 to 125°C. It has a max input voltage of 28V and resonant control technique, suitable for automotive applications due to its small outline package style and high switching frequency of 25 kHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,822 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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2,500

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Digiode

USA . 161 parts In-Stock

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161

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Nova Conductors

Japan . 53 parts In-Stock

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53

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,826 parts In-Stock

1+ parts

$3.484

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2,826

$3.484

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Ampacity Inc.

Singapore . 685 parts In-Stock

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$6.500

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685

$6.500

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AZTECH Wire

Italy . 578 parts In-Stock

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$17.521

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578

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$29.316

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$26.678

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$24.039

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1,000

$29.316

$26.678

$24.039

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Kulean Microsystems

USA . 6,519 parts In-Stock

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Problanco Electronics

Mexico . 6,030 parts In-Stock

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SupplyDigital Components

Austria . 6,023 parts In-Stock

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Continental Prestige Electronics

USA . 5,875 parts In-Stock

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TANS Electronics

Latvia . 4,777 parts In-Stock

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RC Electronics

USA . 3,330 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Corphita

USA . 2,231 parts In-Stock

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UHIMA Technologies

Türkiye . 825 parts In-Stock

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Corohmni

South Africa . 490 parts In-Stock

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490

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Kepictronics

USA . 368 parts In-Stock

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368

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Argo Parts USA

USA . 317 parts In-Stock

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317

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Microchip USA

USA . 265 parts In-Stock

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265

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Vigor

Singapore . 181 parts In-Stock

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181

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Aranea Global

USA . 50 parts In-Stock

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Overview

Discover the NCP1339HDR2G by Onsemi, a top-tier switching regulator & controller designed to deliver unparalleled performance and reliability. With Onsemi's reputation for producing high-quality components, this product is guaranteed to exceed your expectations. Ideal for a wide range of applications, this compact and efficient device offers customers unmatched value and benefits. Say goodbye to technical headaches and hello to seamless operation with the NCP1339HDR2G. Experience the difference today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and resistance to external elements, ensuring a long lifespan for the product.

Surface Mount:

YES - Allows for easy and efficient installation onto circuit boards, saving time during assembly.

Package Shape:

RECTANGULAR - Offers a standard shape that is easy to work with and integrate into various designs.

No. of Terminals:

13 - Provides flexibility for connecting to other components and peripherals, expanding the product's capabilities.

Package Style (Meter):

SMALL OUTLINE - Saves space on the PCB, making this product ideal for compact and densely packed electronic devices.

Maximum Operating Temperature:

125 °C - Ensures reliable performance even in high-temperature environments, making it suitable for a wide range of applications.

Control Mode:

CURRENT-MODE - Offers efficient and precise control over the switching regulator, improving overall performance and stability.

Minimum Operating Temperature:

40 °C - Can operate in extremely cold conditions without compromising performance, making it versatile for various environments.

Terminal Finish:

MATTE TIN - Provides a durable and corrosion-resistant finish, ensuring a reliable electrical connection over time.

Terminal Position:

DUAL - Allows for easy connection and integration into the circuit layout, improving efficiency during assembly.

Maximum Seated Height:

1.75 mm - Low profile design enables the product to be used in slim electronic devices without sacrificing performance.

Width (mm):

3.9 mm - Compact size allows for easy placement on the PCB, saving valuable space in the overall design.

Other IC type:

SWITCHING CONTROLLER - Offers advanced control features, enhancing the efficiency and performance of the switching regulator.

Nominal Input Voltage:

12 V - Compatible with a wide range of power sources, making it versatile for different applications and projects.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during assembly, reducing the risk of defects and ensuring reliability.

Peak Reflow Temperature °C:

260 - Withstands high-temperature soldering processes, ensuring a secure and durable connection to the PCB.

Length:

8.65 mm - Compact design allows for flexible placement on the circuit board, optimizing the layout for better performance.

Temperature Grade:

AUTOMOTIVE - Designed to withstand harsh environmental conditions, making it suitable for automotive applications where reliability is crucial.

Maximum Switching Frequency:

25 kHz - Provides fast and efficient power regulation, improving overall performance and stability of the system.

Terminal Form:

GULL WING - Offers a secure and reliable connection, ensuring proper functionality in various operating conditions.

Control Technique:

RESONANT CONTROL - Provides advanced control features that optimize efficiency and reduce power consumption, improving overall performance.

Terminal Pitch:

1.27 mm - Standard pitch spacing allows for easy connection to other components, simplifying the assembly process.

Minimum Input Voltage:

10 V - Allows for operation with low input voltages, providing flexibility for various power sources and applications.

Maximum Input Voltage:

28 V - Handles high input voltages with ease, making it suitable for a wide range of power supply configurations.

Technical Specifications

Switching Regulators & Controllers NCP1339HDR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

CONFIGURED AS FLYBACK TOPOLOGY

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

RESONANT CONTROL

Maximum Input Voltage:

28 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G13

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

13

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

25 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1339HDR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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