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NCP1406SNT1G

Onsemi

NCP1406SNT1G by Onsemi

NCP1406SNT1G by Onsemi is a switching regulator with current-mode control, operating b/w -40 to 85°C. It has a boost configuration, supporting input voltages from 1.4V to 5.5V and output currents up to 25mA. Ideal for industrial applications requiring high-frequency pulse modulation in a compact SOT-23 package.

Median Price

$0.706

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 933 parts In-Stock

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$0.400

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Nova Conductors

Japan . 10 parts In-Stock

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$0.517

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$0.517

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Ozdisan Elektronik

Türkiye . 35 parts In-Stock

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$0.894

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Mobius Materials

USA . 6,100 parts In-Stock

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Chip Stock

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Semtec, LLC

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Cyclops Electronics Ltd

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Sensible Micro Corp

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Vyrian

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ComSIT Distribution GmbH

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Digiode

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Vigor

Singapore . 888 parts In-Stock

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$0.280

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Continental Prestige Electronics

USA . 5,692 parts In-Stock

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$0.422

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Argo Parts USA

USA . 2,281 parts In-Stock

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$0.422

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$0.409

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Corohmni

South Africa . 84 parts In-Stock

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$0.507

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Ampacity Inc.

Singapore . 1,481 parts In-Stock

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$2.500

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Aztec Data Supply Inc.

USA . 4,389 parts In-Stock

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$2.710

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Semicontronic

India . 142 parts In-Stock

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$5.500

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$5.362

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$5.335

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$10.579

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$10.050

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$10.050

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AZTECH Wire

Italy . 607 parts In-Stock

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$15.648

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Perfect Parts

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GreenTree Electronics

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Lucentia Tech

USA . 4,941 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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SupplyDigital Components

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Futuretech Components

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iodParts Technologies Inc.

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UHIMA Technologies

Türkiye . 841 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unlock the potential of your electronic devices with the NCP1406SNT1G by Onsemi, a top-of-the-line switching regulator that guarantees superior performance and reliability. Manufactured by industry leader Onsemi, this product is designed to meet the highest standards in the market. Ideal for a wide range of applications, this switching regulator offers unmatched efficiency and precision, ensuring optimal power management for your devices. Experience the value and benefits of the NCP1406SNT1G and take your electronics to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material helps in reducing overall weight of the product, making it easier to handle and portable.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly, saving space on the PCB and reducing production costs.

No. of Terminals: 5

Having more terminals allows for more flexibility in connecting external components and peripherals, enhancing the functionality of the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and reliability of the product even in harsh environmental conditions.

Control Mode: CURRENT-MODE

Current-mode control provides fast transient response and improved performance in regulating output voltage, leading to better overall efficiency.

Technical Specifications

Switching Regulators & Controllers NCP1406SNT1G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

ADJUSTABLE OUTPUT VOLTAGE UP TO 25 V

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE FREQUENCY MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1.4 V

Nominal Input Voltage:

3 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.025 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

1000 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP1406SNT1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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