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NCP1255BD65R2G

Onsemi

NCP1255BD65R2G by Onsemi

NCP1255BD65R2G by Onsemi is a current-mode switching controller with max. switching frequency of 65 kHz. It comes in a small outline package with 8 terminals, suitable for surface mount applications. The IC is designed for efficient power regulation in various electronic devices.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 11,359 parts In-Stock

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Digiode

USA . 1,542 parts In-Stock

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AZTECH Wire

Italy . 916 parts In-Stock

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Advanced Electronics

New Zealand . 21 parts In-Stock

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$26.810

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$24.397

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Perfect Parts

USA . 18,822 parts In-Stock

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Kulean Microsystems

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TANS Electronics

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QUARKTWIN TECHNOLOGY LTD

USA . 4,433 parts In-Stock

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S.R.D Solutions

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SupplyDigital Components

Austria . 1,528 parts In-Stock

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UHIMA Technologies

Türkiye . 646 parts In-Stock

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Corohmni

South Africa . 385 parts In-Stock

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Corphita

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Microchip USA

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Problanco Electronics

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Overview

Discover the NCP1255BD65R2G by Onsemi, a cutting-edge switching regulator and controller that stands out for its superior quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers unparalleled performance and efficiency. Ideal for a wide range of applications, this small outline package features current-mode control mode and a maximum switching frequency of 65 kHz. With dual terminal position and gull wing terminal form, this product ensures seamless integration and optimal functionality. Unlock the value and benefits of the NCP1255BD65R2G and experience enhanced power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good electrical insulation and thermal conductivity, making the product reliable and efficient.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and reducing production costs.

Package Shape: RECTANGULAR

Rectangular shape is compact and space-saving, making it suitable for applications where size is a constraint.

No. of Terminals: 8

Having 8 terminals allows for flexibility in connection options and functionalities in the circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on PCB and allows for high-density mounting of components.

Control Mode: CURRENT-MODE

Current-mode control provides better transient response and stability in regulating the output voltage.

Terminal Finish: TIN

TIN terminal finish offers corrosion resistance and good solderability, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for improved thermal performance and reduced resistance in power delivery.

Maximum Switching Frequency: 65 kHz

High switching frequency allows for efficient power conversion and reduced size of external components like inductors and capacitors.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch enables precise and reliable connection with other components on the PCB, reducing signal interference.

Technical Specifications

Switching Regulators & Controllers NCP1255BD65R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

65 kHz

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NCP1255BD65R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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