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NCP1219BD100R2G

Onsemi

NCP1219BD100R2G by Onsemi

NCP1219BD100R2G by Onsemi is a current-mode switching regulator with max. switching frequency of 107 kHz. It features small outline package style, matte tin terminal finish, and dual terminal position. Ideal for applications requiring efficient power management in compact electronic devices.

Median Price

$17.168

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$17.168

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10

$17.168

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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Digiode

USA . 2,252 parts In-Stock

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2,252

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Vyrian

USA . 1,948 parts In-Stock

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1,948

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Distributors (Availability)

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Vigor

Singapore . 638 parts In-Stock

1+ parts

$0.470

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638

$0.470

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AZTECH Wire

Italy . 921 parts In-Stock

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$9.940

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921

$9.940

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QUARKTWIN TECHNOLOGY LTD

USA . 27,170 parts In-Stock

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Perfect Parts

USA . 14,353 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,936 parts In-Stock

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SupplyDigital Components

Austria . 5,252 parts In-Stock

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Kepictronics

USA . 5,033 parts In-Stock

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TANS Electronics

Latvia . 4,479 parts In-Stock

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Problanco Electronics

Mexico . 2,321 parts In-Stock

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Metaverse IC Inc.

Canada . 1,932 parts In-Stock

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Kulean Microsystems

USA . 1,070 parts In-Stock

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Corphita

USA . 669 parts In-Stock

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669

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UHIMA Technologies

Türkiye . 491 parts In-Stock

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491

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Corohmni

South Africa . 317 parts In-Stock

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Microchip USA

USA . 160 parts In-Stock

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160

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Overview

Discover the NCP1219BD100R2G by Onsemi, a top-quality switching regulator designed to provide optimal performance in various applications. Crafted by the renowned manufacturer Onsemi, this product offers reliability, efficiency, and versatility. With its compact design and advanced features like current-mode control, matte tin terminal finish, and high switching frequency, this regulator ensures seamless operation and precise power management. Whether you're in the automotive, industrial, or consumer electronics industry, the NCP1219BD100R2G delivers unmatched value, benefits, and advantages to meet your unique needs. Experience superior quality and performance with this cutting-edge solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a durable and lightweight material, making the product sturdy and easy to handle.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

No. of Terminals: 7

Having 7 terminals provides flexibility for connections and configurations in different circuit setups.

Control Mode: CURRENT-MODE

Current-mode control allows for accurate regulation of output voltage, enhancing overall performance and efficiency.

Maximum Switching Frequency: 107 kHz

A high switching frequency enables faster response times and better stability in regulating output voltages.

Technical Specifications

Switching Regulators & Controllers NCP1219BD100R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

7

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP7/8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

107 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NCP1219BD100R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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