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NCP1207BDR2G

Onsemi

NCP1207BDR2G by Onsemi

NCP1207BDR2G by Onsemi is a switching controller with current-mode control technique, operating temperature range of -40 to 125°C. It has a max output current of 0.5A and supports a max switching frequency of 200kHz. Ideal for automotive applications due to its small outline package style and CMOS technology.

Median Price

$1.521

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 70 parts In-Stock

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$1.521

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HZD GmbH

Germany . 20,000 parts In-Stock

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Chip Stock

USA . 10,230 parts In-Stock

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Flip Electronics

USA . 10,000 parts In-Stock

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Vyrian

USA . 3,476 parts In-Stock

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Digiode

USA . 392 parts In-Stock

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Prism Electronics

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Rebound Electronics

UK . 314 parts In-Stock

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Bristol Electronics

USA . 154 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 231 parts In-Stock

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$1.050

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231

$1.050

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Corohmni

South Africa . 185 parts In-Stock

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$1.491

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Argo Parts USA

USA . 2,774 parts In-Stock

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$1.521

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Continental Prestige Electronics

USA . 2,389 parts In-Stock

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$1.521

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$1.491

2,389

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$1.491

Netroflash

USA . 100 parts In-Stock

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$1.521

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$1.491

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100

$1.521

$1.491

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Semicontronic

India . 465 parts In-Stock

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$4.500

100+ parts

$4.388

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$4.365

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465

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 236 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 493 parts In-Stock

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$13.543

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Lixinc

USA . 18,018 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,951 parts In-Stock

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SupplyDigital Components

Austria . 5,470 parts In-Stock

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Kulean Microsystems

USA . 4,274 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,085 parts In-Stock

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TANS Electronics

Latvia . 2,690 parts In-Stock

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Metaverse IC Inc.

Canada . 2,480 parts In-Stock

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Problanco Electronics

Mexico . 2,102 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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UHIMA Technologies

Türkiye . 930 parts In-Stock

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Corphita

USA . 614 parts In-Stock

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Kepictronics

USA . 103 parts In-Stock

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Overview

Designed by the reputable manufacturer Onsemi, the NCP1207BDR2G is a cutting-edge switching regulator and controller that guarantees top-notch performance and reliability. With its innovative technology and automotive-grade temperature grade, this small outline package offers customers unparalleled efficiency and precision in various applications. Whether you're looking to optimize power management in your automotive design or enhance energy conversion in industrial equipment, this switching controller is the ultimate solution for all your needs. Upgrade your projects today with the NCP1207BDR2G and experience the superior quality and value that Onsemi delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various environments.

Surface Mount: YES

Enables easy and efficient mounting on PCBs, saving space and simplifying manufacturing processes.

Control Mode: CURRENT-MODE

Efficiently regulates the output voltage by adjusting the current, leading to better power efficiency and performance.

Maximum Operating Temperature: 125 °C

Allows the product to operate in high-temperature conditions without risking damage or performance issues.

Minimum Operating Temperature: -40 °C

Ensures the product can function in extreme cold environments, expanding its range of applications.

Maximum Output Current: 0.5 A

Capable of delivering a sufficient amount of current to power various electronic devices and circuits.

Technical Specifications

Switching Regulators & Controllers NCP1207BDR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

ALSO HAS RESONANT CONTROL TECHNIQUE

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

10.6 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G7

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP7/8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

200 kHz

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1207BDR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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