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NCN2612MTTWG

Onsemi

NCN2612MTTWG by Onsemi

The Onsemi NCN2612MTTWG is a 6-function SPDT multiplexer with 3.3V supply voltage, 13 ohm max resistance, and 20ns switch-on time. Ideal for industrial applications requiring separate output signals in a compact chip carrier package with surface mount capability.

Median Price

$1.314

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,505 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.050

7,505

-

$1.240

$1.110

$1.050

Verical

USA . 5,515 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.387

10k+ parts

$1.313

5,515

-

-

$1.387

$1.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 654 parts In-Stock

1+ parts

$1.320

100+ parts

-

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654

$1.320

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Vyrian

USA . 3,901 parts In-Stock

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3,901

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-

Distributors (Availability)

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Corphita

USA . 1,735 parts In-Stock

1+ parts

$1.251

100+ parts

-

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1,735

$1.251

-

-

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Corohmni

South Africa . 75 parts In-Stock

1+ parts

$1.390

100+ parts

-

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75

$1.390

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AZTECH Wire

Italy . 202 parts In-Stock

1+ parts

$12.540

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202

$12.540

-

-

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Kulean Microsystems

USA . 8,267 parts In-Stock

1+ parts

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8,267

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SupplyDigital Components

Austria . 7,670 parts In-Stock

1+ parts

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7,670

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Continental Prestige Electronics

USA . 7,415 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.190

10k+ parts

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7,415

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-

$1.190

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TANS Electronics

Latvia . 7,411 parts In-Stock

1+ parts

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7,411

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Microchip USA

USA . 4,136 parts In-Stock

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4,136

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Problanco Electronics

Mexico . 2,535 parts In-Stock

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2,535

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 898 parts In-Stock

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898

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Futuretech Components

Singapore . 350 parts In-Stock

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350

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Perfect Parts

USA . 334 parts In-Stock

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334

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Overview

Discover the Onsemi NCN2612MTTWG, a top-of-the-line multiplexer and switch that offers unparalleled quality and reliability. Manufactured by industry leader Onsemi, this product is designed to meet the highest standards in performance and durability. With its 6 functions and advanced features like separate output and break-before-make switching, this versatile chip carrier package is perfect for a wide range of industrial applications. Experience seamless operation and superior functionality with the Onsemi NCN2612MTTWG, providing exceptional value and benefits to customers looking for top-notch multiplexers and switches.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy PCB assembly and reduces the overall size of the product, making it ideal for space-constrained applications.

No. of Functions: 6

With 6 functions in one device, this multiplexer & switch offers versatility and can handle multiple signals efficiently, saving on component count and board space.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a standard voltage of 3.3V makes it compatible with many systems and reduces the need for additional voltage regulation circuitry.

Maximum Operating Temperature: 85 °C

With a high operating temperature range of up to 85 °C, this product is suitable for industrial applications where extended temperature tolerance is required.

Maximum On-state Resistance (Ron): 13 ohm

Low on-state resistance ensures minimal signal loss and distortion, making this multiplexer & switch an efficient choice for signal routing and processing.

Technical Specifications

Multiplexers & Switches NCN2612MTTWG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XQCC-N56

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Terminals:

56

Maximum On-state Resistance (Ron):

13 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC56,.19X.43,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-on Time:

20 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

NCN2612MTTWG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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