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NC7SZ57L6X-L22175

Onsemi

NC7SZ57L6X-L22175 by Onsemi

The Onsemi NC7SZ57L6X-L22175 is a CMOS Logic Gate with 2 inputs, 8.5 ns propagation delay, and 50 pF load capacitance. Ideal for applications requiring fast signal processing in compact designs. Operates b/w -40 to 85 °C with a supply voltage range of 1.65V to 5.5V, making it versatile for various electronic projects.

Median Price

$0.144

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 33 parts In-Stock

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$0.144

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33

$0.144

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Vyrian

USA . 9,936 parts In-Stock

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Digiode

USA . 2,173 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 343 parts In-Stock

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$0.141

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343

$0.141

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Continental Prestige Electronics

USA . 2,417 parts In-Stock

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$0.143

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$0.140

2,417

$0.143

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$0.140

Argo Parts USA

USA . 578 parts In-Stock

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$0.143

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$0.139

578

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Netroflash

USA . 2,000 parts In-Stock

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$0.144

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$0.137

10k+ parts

$0.134

2,000

$0.144

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$0.137

$0.134

AZTECH Wire

Italy . 228 parts In-Stock

1+ parts

$14.773

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228

$14.773

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Ampacity Inc.

Singapore . 1,082 parts In-Stock

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$45.000

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Kulean Microsystems

USA . 7,166 parts In-Stock

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SupplyDigital Components

Austria . 5,017 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,126 parts In-Stock

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Microchip USA

USA . 3,547 parts In-Stock

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Problanco Electronics

Mexico . 2,552 parts In-Stock

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TANS Electronics

Latvia . 1,680 parts In-Stock

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Corphita

USA . 1,128 parts In-Stock

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UHIMA Technologies

Türkiye . 990 parts In-Stock

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990

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Overview

Enhance your electronic designs with the NC7SZ57L6X-L22175 by Onsemi, a high-quality logic gate that offers exceptional performance and reliability. Onsemi is renowned for its cutting-edge technology and innovative solutions in the semiconductor industry, making them a trusted manufacturer you can rely on. Ideal for a wide range of applications, this logic gate provides fast propagation delay and low power consumption, ensuring efficient operation. Upgrade your projects with the value and benefits that this product brings, delivering superior functionality and precision to meet your design needs. Trust in Onsemi and experience the advantages of the NC7SZ57L6X-L22175 for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a durable and cost-effective solution for housing the logic gates.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast and efficient operation of the logic gates.

Surface Mount: YES

Being surface mountable makes it easy to integrate these logic gates onto circuit boards.

No. of Inputs: 2

Having 2 inputs allows for a variety of logic operations to be performed.

Package Shape: RECTANGULAR

The rectangular shape provides ease of handling and integration into electronic systems.

Nominal Supply Voltage / Vsup (V): 2.3

The nominal supply voltage is within a commonly used range in electronic devices.

Load Capacitance (CL): 50 pF

This load capacitance ensures compatibility with a wide range of applications.

No. of Terminals: 6

The 6 terminals provide ample connection points for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile make these logic gates suitable for space-constrained designs.

Maximum I (ol): 32 Amp

The high maximum output current allows for driving of various loads.

Propagation Delay (tpd): 14.5 ns

With a relatively low propagation delay, these logic gates offer fast response times.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, these logic gates can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board layout and connection options.

Maximum Seated Height: 0.55 mm

The low seated height makes these logic gates suitable for compact designs.

Width: 1 mm

The small width enables dense packaging of logic gates on circuit boards.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage allows for operation in low-power applications.

Length: 1.45 mm

The compact length of these logic gates saves space on circuit boards.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly and reduces the risk of solder joint failure.

Packing Method: TR

Trays provide convenient storage and transportation of these logic gates.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting on circuit boards.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage, these logic gates are versatile in their applications.

Maximum Power Supply Current (ICC): 50 mA

The maximum power supply current ensures that these logic gates can handle various loads effectively.

Technical Specifications

Logic Gates NC7SZ57L6X-L22175 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-N6

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

14.5 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NC7SZ57L6X-L22175 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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