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NC7ST32P5X-L22057

Onsemi

NC7ST32P5X-L22057 by Onsemi

The Onsemi NC7ST32P5X-L22057 is a CMOS Logic Gate with 2 inputs, Vsup range of 4.5V to 5.5V, and tpd of 31ns. Ideal for applications requiring fast signal processing in compact designs due to its small outline package style and low power consumption of 25mA at max Vsup.

Median Price

$0.104

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 15,000 parts In-Stock

1+ parts

$0.136

100+ parts

$0.089

1k+ parts

$0.073

10k+ parts

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15,000

$0.136

$0.089

$0.073

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Verical

USA . 15,000 parts In-Stock

1+ parts

-

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$0.073

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15,000

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-

$0.073

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Distributors (In-Stock)

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Flip Electronics

USA . 21,000 parts In-Stock

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Vyrian

USA . 2,154 parts In-Stock

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Digiode

USA . 801 parts In-Stock

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801

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Distributors (Availability)

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Microchip USA

USA . 7,102 parts In-Stock

1+ parts

$0.515

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7,102

$0.515

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AZTECH Wire

Italy . 648 parts In-Stock

1+ parts

$17.390

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648

$17.390

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Component Stockers USA

USA . 222 parts In-Stock

1+ parts

$99.990

100+ parts

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222

$99.990

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Kulean Microsystems

USA . 5,418 parts In-Stock

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5,418

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Problanco Electronics

Mexico . 4,854 parts In-Stock

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SupplyDigital Components

Austria . 1,838 parts In-Stock

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TANS Electronics

Latvia . 1,415 parts In-Stock

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UHIMA Technologies

Türkiye . 984 parts In-Stock

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984

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Corphita

USA . 147 parts In-Stock

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Corohmni

South Africa . 119 parts In-Stock

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Overview

Enhance your electronic designs with the NC7ST32P5X-L22057 by Onsemi. Manufactured with precision and expertise, this logic gate offers reliable performance and quality you can trust. Ideal for a wide range of applications, this product provides seamless integration and efficiency. With its compact design and advanced technology, customers can expect superior functionality and value. Upgrade your projects today with the NC7ST32P5X-L22057 and experience the benefits of innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the logic gate.

Surface Mount: YES

Allows for easy and convenient integration into circuit boards, saving time and effort during assembly.

No. of Inputs: 2

Suitable for basic logic operations and circuits, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, compatible with many other components in a circuit.

Maximum Power Supply Current (ICC): 25 mA

Consumes low power, ensuring energy efficiency in the overall circuit design.

Technical Specifications

Logic Gates NC7ST32P5X-L22057 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HST/T

JESD-30 Code:

R-PDSO-G5

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay (tpd):

31 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

NC7ST32P5X-L22057 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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