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NBA3N200SDG

Onsemi

NBA3N200SDG by Onsemi

NBA3N200SDG by Onsemi is a Line Transceiver with 8 terminals, operating at 3.3V supply voltage and supporting differential output. It is designed for automotive applications, featuring AEC-Q100 screening level and a temperature range from -40 to 125°C. The device has a small outline package style, Gull Wing terminal form, and can handle up to 8A of low output current.

Median Price

$3.110

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 36 parts In-Stock

1+ parts

$3.110

100+ parts

$2.620

1k+ parts

$2.260

10k+ parts

$1.970

36

$3.110

$2.620

$2.260

$1.970

DigiKey

USA . 1 parts In-Stock

1+ parts

$3.110

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$3.110

-

-

-

Farnell

UK . 37,804 parts In-Stock

1+ parts

$3.329

100+ parts

$2.459

1k+ parts

-

10k+ parts

-

37,804

$3.329

$2.459

-

-

Chip1Stop

Japan . 89 parts In-Stock

1+ parts

$10.100

100+ parts

-

1k+ parts

-

10k+ parts

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89

$10.100

-

-

-

Rochester

USA . 37,804 parts In-Stock

1+ parts

-

100+ parts

$1.520

1k+ parts

$1.360

10k+ parts

$1.280

37,804

-

$1.520

$1.360

$1.280

Verical

USA . 20,482 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.700

10k+ parts

$1.600

20,482

-

-

$1.700

$1.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,604 parts In-Stock

1+ parts

$1.606

100+ parts

-

1k+ parts

-

10k+ parts

-

1,604

$1.606

-

-

-

Vyrian

USA . 3,821 parts In-Stock

1+ parts

-

100+ parts

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3,821

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Euro-Tech

UK . 129 parts In-Stock

1+ parts

-

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1k+ parts

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129

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,188 parts In-Stock

1+ parts

$1.521

100+ parts

-

1k+ parts

-

10k+ parts

-

2,188

$1.521

-

-

-

Corohmni

South Africa . 343 parts In-Stock

1+ parts

$1.690

100+ parts

-

1k+ parts

-

10k+ parts

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343

$1.690

-

-

-

Component Stockers USA

USA . 15,396 parts In-Stock

1+ parts

$1.760

100+ parts

$1.650

1k+ parts

$1.490

10k+ parts

$1.490

15,396

$1.760

$1.650

$1.490

$1.490

Continental Prestige Electronics

USA . 17,322 parts In-Stock

1+ parts

$2.600

100+ parts

-

1k+ parts

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10k+ parts

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17,322

$2.600

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-

-

QUARKTWIN TECHNOLOGY LTD

USA . 12,016 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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12,016

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SupplyDigital Components

Austria . 5,827 parts In-Stock

1+ parts

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5,827

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Microchip USA

USA . 4,565 parts In-Stock

1+ parts

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100+ parts

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4,565

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-

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Kulean Microsystems

USA . 3,524 parts In-Stock

1+ parts

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3,524

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TANS Electronics

Latvia . 2,072 parts In-Stock

1+ parts

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2,072

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-

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Problanco Electronics

Mexico . 1,414 parts In-Stock

1+ parts

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100+ parts

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1,414

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-

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Perfect Parts

USA . 797 parts In-Stock

1+ parts

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797

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Authorized Procurement Solutions

USA . 89 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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89

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GreenTree Electronics

Israel . 89 parts In-Stock

1+ parts

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89

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UHIMA Technologies

Türkiye . 74 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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74

-

-

-

-

Overview

Experience seamless and reliable data transmission with the NBA3N200SDG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Line Drivers & Receivers suitable for various applications. From automotive to industrial settings, this product excels in providing efficient signal processing and communication. With a durable plastic/epoxy body and AEC-Q100 screening level, this small outline package ensures high performance even in extreme temperatures. Trust in Onsemi's expertise and choose the NBA3N200SDG for your next project, where quality meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying assembly.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and performance in automotive environments, making it a suitable choice for automotive applications.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with standard power supplies, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in harsh environments, such as automotive applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring a reliable connection over time.

Differential Output: YES

Differential output ensures high noise immunity and signal integrity, making it ideal for use in noisy environments such as automotive systems.

Maximum Supply Current: 22 mA

The low maximum supply current of 22 mA helps in reducing power consumption, making it an energy-efficient choice for applications where power efficiency is crucial.

Technical Specifications

Line Drivers & Receivers NBA3N200SDG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Screening Level:

AEC-Q100

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

22 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NBA3N200SDG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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