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NBA3N206SDG

Onsemi

NBA3N206SDG by Onsemi

NBA3N206SDG by Onsemi is a Line Transceiver with 8 terminals, operating at 3.3V nominal voltage. It offers differential output and input characteristics, with a max transmit delay of 2.4ns. Ideal for automotive applications due to AEC-Q100 screening level and small outline package style.

Median Price

$1.536

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$0.518

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$0.518

-

-

-

Farnell

UK . 81 parts In-Stock

1+ parts

$1.200

100+ parts

-

1k+ parts

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81

$1.200

-

-

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Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$1.490

100+ parts

-

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1

$1.490

-

-

-

Newark

USA . 81 parts In-Stock

1+ parts

$2.270

100+ parts

$1.540

1k+ parts

$1.120

10k+ parts

$1.010

81

$2.270

$1.540

$1.120

$1.010

Element14

Singapore . 81 parts In-Stock

1+ parts

$3.490

100+ parts

$2.370

1k+ parts

$1.720

10k+ parts

$1.480

81

$3.490

$2.370

$1.720

$1.480

Rochester

USA . 40,650 parts In-Stock

1+ parts

-

100+ parts

$1.510

1k+ parts

$1.250

10k+ parts

$1.120

40,650

-

$1.510

$1.250

$1.120

DigiKey

USA . 40,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.890

10k+ parts

-

40,650

-

-

$1.890

-

Verical

USA . 22,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.563

10k+ parts

$1.400

22,442

-

-

$1.563

$1.400

Flip Electronics (Authorized)

USA . 21,658 parts In-Stock

1+ parts

-

100+ parts

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21,658

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,446 parts In-Stock

1+ parts

$0.262

100+ parts

-

1k+ parts

-

10k+ parts

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1,446

$0.262

-

-

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Vyrian

USA . 700 parts In-Stock

1+ parts

$0.276

100+ parts

-

1k+ parts

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700

$0.276

-

-

-

Flip Electronics

USA . 21,658 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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21,658

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 510 parts In-Stock

1+ parts

$0.248

100+ parts

-

1k+ parts

-

10k+ parts

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510

$0.248

-

-

-

Corohmni

South Africa . 326 parts In-Stock

1+ parts

$0.276

100+ parts

-

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10k+ parts

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326

$0.276

-

-

-

Continental Prestige Electronics

USA . 18,208 parts In-Stock

1+ parts

$1.960

100+ parts

$1.390

1k+ parts

$1.020

10k+ parts

-

18,208

$1.960

$1.390

$1.020

-

Microchip USA

USA . 400 parts In-Stock

1+ parts

$16.250

100+ parts

-

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400

$16.250

-

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SupplyDigital Components

Austria . 7,551 parts In-Stock

1+ parts

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7,551

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Problanco Electronics

Mexico . 5,674 parts In-Stock

1+ parts

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5,674

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-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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TANS Electronics

Latvia . 1,250 parts In-Stock

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1,250

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Kulean Microsystems

USA . 619 parts In-Stock

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619

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Perfect Parts

USA . 379 parts In-Stock

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379

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UHIMA Technologies

Türkiye . 101 parts In-Stock

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101

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Overview

Enhance your automotive electronics with the NBA3N206SDG line driver & receiver by Onsemi. With a focus on quality and reliability, Onsemi is a trusted manufacturer in the industry. This product offers seamless communication between devices, ensuring smooth data transmission. Ideal for automotive applications, this compact and efficient device provides customers with a valuable solution for their connectivity needs. Upgrade your systems with the NBA3N206SDG and experience the benefits of superior performance and increased efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and improving efficiency.

Maximum Supply Voltage: 3.6 V

Can handle a relatively high supply voltage, making it suitable for a variety of applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures reliability and suitability for automotive applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Maximum Transmit Delay: 2.4 ns

Low transmit delay ensures fast and efficient data transmission.

No. of Terminals: 8

Sufficient number of terminals for proper connectivity in the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space on the board.

Maximum High Level Input Current: 0.00001 Amp

Low input current requirement reduces power consumption and heat generation.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, making it energy-efficient.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for use in various environmental conditions.

Output Characteristics: DIFFERENTIAL

Differential output provides noise immunity and better signal integrity.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold temperatures, suitable for automotive and industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for flexibility in installation and connectivity.

Maximum Seated Height: 1.75 mm

Low seated height saves space on the board and reduces interference with other components.

Width: 3.9 mm

Compact width helps in efficient board layout and space utilization.

Maximum Output Low Current: 8 Amp

High output current capability for driving external components.

Output Polarity: COMPLEMENTARY

Complementary output polarity allows for easy integration with other components.

Differential Output: YES

Differential output configuration provides noise immunity and signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow time ensures proper soldering and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable soldering.

Length: 4.9 mm

Compact length for efficient board layout and space utilization.

Minimum Out Swing: 2 V

Low out swing requirement allows for compatibility with various input signals.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability in harsh operating conditions.

Maximum Receive Delay: 6 ns

Low receive delay enables fast data reception and response.

Terminal Form: GULL WING

Gull wing terminal form provides good mechanical strength and solder joint reliability.

Maximum Supply Current: 24 mA

Low supply current requirement for energy efficiency.

Input Characteristics: DIFFERENTIAL

Differential input configuration provides noise immunity and signal integrity.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration into circuit boards.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type for seamless communication between different components.

Technical Specifications

Line Drivers & Receivers NBA3N206SDG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

1

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.4 ns

Width:

3.9 mm

Trade Compliance

NBA3N206SDG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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