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NBA3N200SDR2G

Onsemi

NBA3N200SDR2G by Onsemi

NBA3N200SDR2G by Onsemi is an AEC-Q100 compliant Line Transceiver with 8 terminals, operating at 3.3V supply voltage and consuming 22mA max current. It offers differential output, peak reflow temp of 260 °C, and automotive temperature grade suitability. Ideal for automotive applications requiring fast response time (6ns) and low power consumption (8A max).

Median Price

$2.330

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 83 parts In-Stock

1+ parts

$3.140

100+ parts

$1.950

1k+ parts

$1.730

10k+ parts

$1.670

83

$3.140

$1.950

$1.730

$1.670

Rochester

USA . 46 parts In-Stock

1+ parts

-

100+ parts

$1.520

1k+ parts

$1.360

10k+ parts

$1.280

46

-

$1.520

$1.360

$1.280

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 85 parts In-Stock

1+ parts

$1.606

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$1.606

-

-

-

Vyrian

USA . 1,737 parts In-Stock

1+ parts

$1.690

100+ parts

-

1k+ parts

-

10k+ parts

-

1,737

$1.690

-

-

-

Flip Electronics

USA . 22,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,378 parts In-Stock

1+ parts

$1.521

100+ parts

-

1k+ parts

-

10k+ parts

-

2,378

$1.521

-

-

-

Corohmni

South Africa . 100 parts In-Stock

1+ parts

$1.690

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.690

-

-

-

Microchip USA

USA . 5,410 parts In-Stock

1+ parts

$11.170

100+ parts

-

1k+ parts

-

10k+ parts

-

5,410

$11.170

-

-

-

Authorized Procurement Solutions

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50,000

-

-

-

-

Problanco Electronics

Mexico . 5,457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,457

-

-

-

-

SupplyDigital Components

Austria . 2,539 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,539

-

-

-

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TANS Electronics

Latvia . 2,444 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,444

-

-

-

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UHIMA Technologies

Türkiye . 803 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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803

-

-

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Kulean Microsystems

USA . 555 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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555

-

-

-

-

Overview

Experience superior performance and reliability with the NBA3N200SDR2G line driver by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that meet the rigorous standards of automotive applications. The NBA3N200SDR2G is perfect for enhancing communication and signal transmission in automotive systems, providing fast and efficient data transfer. Trust Onsemi to provide you with cutting-edge technology that ensures seamless connectivity and optimal functionality. Elevate your automotive experience with the NBA3N200SDR2G line driver today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for automotive applications where weight and space are critical factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and labor costs during manufacturing.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets rigorous automotive industry standards for reliability and performance, making it a dependable choice for automotive applications.

Power Supplies (V): 3.3

Operating at 3.3V allows for compatibility with standard automotive power systems, ensuring seamless integration into automotive electronics.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product can withstand high temperature environments commonly found in automotive applications, ensuring reliable performance under tough conditions.

Technical Specifications

Line Drivers & Receivers NBA3N200SDR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Screening Level:

AEC-Q100

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

22 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NBA3N200SDR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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