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NB3W1200LMNTXG

Onsemi

NB3W1200LMNTXG by Onsemi

NB3W1200LMNTXG clock driver by Onsemi features 64 terminals, 4.5ns propagation delay, and 3-STATE output characteristics. Ideal for applications requiring differential mux input conditioning, such as high-speed data transmission systems or precision timing circuits. This chip carrier with a very thin profile operates b/w 0 to 70 °C in commercial-grade environments.

Median Price

$5.088

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 995 parts In-Stock

1+ parts

$7.580

100+ parts

$4.959

1k+ parts

$4.485

10k+ parts

$4.393

995

$7.580

$4.959

$4.485

$4.393

Rochester

USA . 48,189 parts In-Stock

1+ parts

-

100+ parts

$4.070

1k+ parts

$3.640

10k+ parts

$3.420

48,189

-

$4.070

$3.640

$3.420

Verical

USA . 33,284 parts In-Stock

1+ parts

-

100+ parts

$5.088

1k+ parts

$4.550

10k+ parts

$4.275

33,284

-

$5.088

$4.550

$4.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 661 parts In-Stock

1+ parts

$4.284

100+ parts

-

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-

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661

$4.284

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Vyrian

USA . 5,850 parts In-Stock

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-

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5,850

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Distributors (Availability)

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Ampacity Inc.

Singapore . 16,136 parts In-Stock

1+ parts

$2.940

100+ parts

-

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16,136

$2.940

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Corohmni

South Africa . 252 parts In-Stock

1+ parts

$3.460

100+ parts

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252

$3.460

-

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Corphita

USA . 1,667 parts In-Stock

1+ parts

$4.059

100+ parts

-

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1,667

$4.059

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 26,810 parts In-Stock

1+ parts

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26,810

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TANS Electronics

Latvia . 7,792 parts In-Stock

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7,792

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SupplyDigital Components

Austria . 6,888 parts In-Stock

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6,888

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Problanco Electronics

Mexico . 5,359 parts In-Stock

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5,359

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Kulean Microsystems

USA . 4,831 parts In-Stock

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4,831

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A-Z Elektronik GmbH

Germany . 4,626 parts In-Stock

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4,626

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Microchip USA

USA . 3,140 parts In-Stock

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Metaverse IC Inc.

Canada . 790 parts In-Stock

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790

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UHIMA Technologies

Türkiye . 685 parts In-Stock

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685

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Continental Prestige Electronics

USA . 565 parts In-Stock

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565

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your clock driver game with the NB3W1200LMNTXG from Onsemi! As a leader in the industry, Onsemi delivers unmatched quality and reliability. Clock drivers & buffers have never been more essential for maintaining precise timing in today's fast-paced world. With its differential MUX input conditioning and 3-STATE output characteristics, this product ensures optimal performance. Experience the benefits of reduced propagation delay, high temperature tolerance, and seamless integration thanks to its surface mount capabilities. Trust Onsemi to provide innovative solutions that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying the assembly process.

Input Conditioning: DIFFERENTIAL MUX

Enables versatile input signal processing, making the product suitable for a wide range of applications.

Propagation Delay (tpd): 4.5 ns

Provides fast signal processing and synchronization, ensuring accurate timing and performance.

Output Characteristics: 3-STATE

Allows the outputs to be in high impedance state when disabled, reducing power consumption and preventing signal interference.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperature environments, increasing the product's reliability and flexibility.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish, ensuring long-term reliability and stable performance.

No. of True Outputs: 24

Offers a high number of output channels, making it suitable for applications requiring multiple clock signals.

Moisture Sensitivity Level (MSL): 3

Indicates that the product is resistant to moisture damage, increasing its lifespan and reliability in various environmental conditions.

Technical Specifications

Clock Drivers & Buffers NB3W1200LMNTXG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB3

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

4.5 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

NB3W1200LMNTXG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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