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NB3W800LMNTXG

Onsemi

NB3W800LMNTXG by Onsemi

NB3W800LMNTXG clock driver by Onsemi features 16 true outputs, operates at a supply voltage range of 3.135V to 3.465V, and has a max operating temperature of 70 °C. Ideal for applications requiring differential mux input conditioning in commercial-grade environments with a compact square package style.

Median Price

$5.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,000 parts In-Stock

1+ parts

$3.201

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

$3.201

-

-

-

DigiKey

USA . 2,450 parts In-Stock

1+ parts

$7.470

100+ parts

$4.880

1k+ parts

$4.412

10k+ parts

$4.296

2,450

$7.470

$4.880

$4.412

$4.296

Chip1Stop

Japan . 2,330 parts In-Stock

1+ parts

$22.700

100+ parts

$10.000

1k+ parts

$6.550

10k+ parts

-

2,330

$22.700

$10.000

$6.550

-

Rochester

USA . 170,343 parts In-Stock

1+ parts

-

100+ parts

$4.000

1k+ parts

$3.580

10k+ parts

$3.370

170,343

-

$4.000

$3.580

$3.370

Verical

USA . 170,000 parts In-Stock

1+ parts

-

100+ parts

$5.000

1k+ parts

$4.475

10k+ parts

$4.213

170,000

-

$5.000

$4.475

$4.213

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,007 parts In-Stock

1+ parts

$3.041

100+ parts

-

1k+ parts

-

10k+ parts

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1,007

$3.041

-

-

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Vyrian

USA . 830 parts In-Stock

1+ parts

$3.201

100+ parts

-

1k+ parts

-

10k+ parts

-

830

$3.201

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,611 parts In-Stock

1+ parts

$2.881

100+ parts

-

1k+ parts

-

10k+ parts

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1,611

$2.881

-

-

-

Corohmni

South Africa . 106 parts In-Stock

1+ parts

$3.201

100+ parts

-

1k+ parts

-

10k+ parts

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106

$3.201

-

-

-

Component Stockers USA

USA . 61,893 parts In-Stock

1+ parts

$4.480

100+ parts

$4.210

1k+ parts

$3.800

10k+ parts

$3.800

61,893

$4.480

$4.210

$3.800

$3.800

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$29.991

100+ parts

$27.292

1k+ parts

$24.593

10k+ parts

-

3,000

$29.991

$27.292

$24.593

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,313 parts In-Stock

1+ parts

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26,313

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Perfect Parts

USA . 16,352 parts In-Stock

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16,352

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-

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A-Z Elektronik GmbH

Germany . 7,193 parts In-Stock

1+ parts

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7,193

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-

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TANS Electronics

Latvia . 6,672 parts In-Stock

1+ parts

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6,672

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Problanco Electronics

Mexico . 6,363 parts In-Stock

1+ parts

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6,363

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SupplyDigital Components

Austria . 5,943 parts In-Stock

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5,943

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GreenTree Electronics

Israel . 2,430 parts In-Stock

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2,430

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Authorized Procurement Solutions

USA . 2,330 parts In-Stock

1+ parts

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100+ parts

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2,330

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Kulean Microsystems

USA . 1,622 parts In-Stock

1+ parts

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1,622

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UHIMA Technologies

Türkiye . 555 parts In-Stock

1+ parts

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555

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iodParts Technologies Inc.

India . 50 parts In-Stock

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50

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Overview

Unlock the power of precision timing with the NB3W800LMNTXG clock driver & buffer from Onsemi. Designed with top-notch quality and reliability, Onsemi is a trusted manufacturer in the industry. This versatile chip carrier with a very thin profile offers differential multiplexed input conditioning and 16 true outputs. Ideal for a wide range of applications, including telecommunications and networking, this square package delivers exceptional performance at a nominal supply voltage of 3.3V. Experience seamless synchronization and enhanced signal integrity with the NB3W800LMNTXG - your go-to solution for clock distribution needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and secure mounting onto PCBs, making the product reliable for long-term use.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning helps in minimizing noise and interference, ensuring accurate and reliable signal transmission.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard voltage of 3.3V makes this product compatible with a wide range of circuits and systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package style enhances thermal performance and allows for compact and efficient integration into electronic devices.

Output Characteristics: 3-STATE

3-state output allows for high impedance when disabled, providing flexibility in signal routing and control.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard environmental conditions, making it suitable for various commercial applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture during storage and assembly processes, increasing its reliability in different manufacturing environments.

Technical Specifications

Clock Drivers & Buffers NB3W800LMNTXG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB3

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

NB3W800LMNTXG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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