Loading...

NB3W800LMNTWG

Onsemi

NB3W800LMNTWG by Onsemi

NB3W800LMNTWG clock driver by Onsemi features 48 terminals, 4.5ns propagation delay, and 16 true outputs. Ideal for applications requiring differential mux input conditioning in a square package style with ECL technology. Operating temperature range from 0 to 70 °C makes it suitable for commercial use.

Median Price

$11.940

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 18,752 parts In-Stock

1+ parts

-

100+ parts

$11.940

1k+ parts

-

10k+ parts

-

18,752

-

$11.940

-

-

Flip Electronics (Authorized)

USA . 18,752 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,752

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,865 parts In-Stock

1+ parts

$11.940

100+ parts

-

1k+ parts

-

10k+ parts

-

1,865

$11.940

-

-

-

Flip Electronics

USA . 18,752 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,752

-

-

-

-

Digiode

USA . 1,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,083

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 99 parts In-Stock

1+ parts

$11.940

100+ parts

-

1k+ parts

-

10k+ parts

-

99

$11.940

-

-

-

Kulean Microsystems

USA . 6,199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,199

-

-

-

-

TANS Electronics

Latvia . 5,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,911

-

-

-

-

Problanco Electronics

Mexico . 3,052 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,052

-

-

-

-

Corphita

USA . 2,311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,311

-

-

-

-

SupplyDigital Components

Austria . 1,516 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,516

-

-

-

-

Microchip USA

USA . 996 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

996

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

UHIMA Technologies

Türkiye . 487 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

487

-

-

-

-

Overview

Enhance the performance of your electronic devices with the NB3W800LMNTWG clock driver by Onsemi. Designed with precision and quality in mind, this product from a trusted manufacturer is perfect for a variety of applications in the Clock Drivers & Buffers category. With its surface mount capability and differential MUX input conditioning, this chip carrier offers customers unmatched value and benefits. Experience faster data transmission, reduced power consumption, and seamless integration into your circuits. Upgrade your technology today with the NB3W800LMNTWG and unlock the full potential of your electronics.

Feature Benefit Bullets

Surface Mount: YES

Surface Mount design makes it easy to integrate into printed circuit boards, making installation and assembly more efficient.

Propagation Delay (tpd): 4.5 ns

Low propagation delay ensures fast and efficient signal transmission, ideal for applications requiring precise timing.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows the product to function reliably in various environments, including colder temperatures.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making this product suitable for applications that require high performance.

Technical Specifications

Clock Drivers & Buffers NB3W800LMNTWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB3

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

4.5 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

NB3W800LMNTWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 6