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NB3H60113GH1MTR2G

Onsemi

NB3H60113GH1MTR2G by Onsemi

NB3H60113GH1MTR2G clock generator by Onsemi operates at a max output frequency of 7.7 MHz, suitable for industrial applications. It features a small outline package with 8 terminals and supports a supply voltage range of 3V to 3.6V. Ideal for systems requiring precise timing control in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,759 parts In-Stock

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Vyrian

USA . 1,558 parts In-Stock

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SupplyDigital Components

Austria . 8,327 parts In-Stock

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Problanco Electronics

Mexico . 6,743 parts In-Stock

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TANS Electronics

Latvia . 2,818 parts In-Stock

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Kulean Microsystems

USA . 2,053 parts In-Stock

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Corphita

USA . 1,681 parts In-Stock

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UHIMA Technologies

Türkiye . 513 parts In-Stock

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Corohmni

South Africa . 158 parts In-Stock

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Overview

Experience seamless clock generation with the NB3H60113GH1MTR2G from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality clock generators that are perfect for a wide range of applications. This product offers customers unparalleled value, benefits, and advantages, making it the ideal choice for your electronic projects. Discover the reliability and performance of the NB3H60113GH1MTR2G by Onsemi today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Support for high supply voltage ensures compatibility with a wide range of circuits and systems.

Package Shape: SQUARE

Square package shape can facilitate easier placement on the PCB and can be more stable compared to other shapes.

Maximum Output Clock Frequency: 7.7 MHz

High maximum output clock frequency capability allows for versatile use in various applications requiring precise timing.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity and integration with other components in the circuit.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Small outline and very thin profile package style helps in space-constrained designs, making it suitable for compact electronic devices.

Minimum Supply Voltage: 3 V

Support for low supply voltage ensures efficient power consumption and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the clock generator to withstand harsh environmental conditions without affecting its performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the clock generator remains operational even in extremely cold environments.

Terminal Finish: NICKEL GOLD PALLADIUM

Nickel gold palladium terminal finish provides enhanced durability, corrosion resistance, and reliable electrical connections.

Terminal Position: DUAL

Having dual terminal position offers greater flexibility in board layout and component placement.

Maximum Seated Height: 0.8 mm

Low maximum seated height ensures compatibility with slim and compact electronic devices.

Width: 2 mm

Narrow width allows for space-efficient placement on the PCB, ideal for designs with limited board space.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature supports quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering without causing damage to the clock generator.

Length: 2 mm

Compact length contributes to the overall small form factor of the clock generator, suitable for miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in a wide range of temperature environments typically found in industrial applications.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Clock generator peripheral IC type with additional capabilities makes it versatile for various system clocking requirements.

Technology: CMOS

CMOS technology offers low power consumption and compatibility with a wide range of digital circuits and systems.

Terminal Form: NO LEAD

No lead terminal form complies with RoHS regulations for environmental friendliness and ensures easy and secure soldering connections.

Nominal Supply Voltage: 3.3 V

Close to nominal supply voltage of 3.3 V ensures stable and efficient operation in many digital systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting on the PCB, suitable for compact designs.

Nominal Primary Clock/Crystal Frequency: 1.54 MHz

Nominal primary clock/crystal frequency of 1.54 MHz offers precise timing reference for various applications requiring synchronization.

Technical Specifications

Clock Generators NB3H60113GH1MTR2G attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

S-XDSO-N8

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

7.7 MHz

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Nominal Primary Clock/Crystal Frequency:

1.54 MHz

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Peripheral IC Type:

Trade Compliance

NB3H60113GH1MTR2G Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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