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NB3H5150MNG

Onsemi

NB3H5150MNG by Onsemi

NB3H5150MNG by Onsemi is a Clock Generator with 32 terminals, operating at 25 MHz frequency. It has a supply voltage range of 2.375V to 2.625V and can withstand temperatures from -40 °C to 85°C. This chip carrier is ideal for industrial applications requiring precise clock generation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,889 parts In-Stock

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Digiode

USA . 204 parts In-Stock

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204

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Problanco Electronics

Mexico . 7,590 parts In-Stock

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7,590

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TANS Electronics

Latvia . 3,170 parts In-Stock

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Kulean Microsystems

USA . 2,484 parts In-Stock

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Corphita

USA . 1,704 parts In-Stock

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UHIMA Technologies

Türkiye . 910 parts In-Stock

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910

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SupplyDigital Components

Austria . 716 parts In-Stock

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Corohmni

South Africa . 374 parts In-Stock

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Overview

Revolutionize your electronic projects with the NB3H5150MNG clock generator by Onsemi. This cutting-edge device offers unparalleled quality and reliability, backed by Onsemi's reputation for excellence in semiconductor manufacturing. Ideal for a wide range of applications, this clock generator is designed to deliver precise timing signals efficiently. With its compact size and advanced technology, the NB3H5150MNG provides exceptional value and performance, ensuring that your projects run smoothly and effectively. Embrace innovation and elevate your designs with Onsemi's NB3H5150MNG clock generator.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient installation on a circuit board, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 2.625 V

The high maximum supply voltage ensures compatibility with a wide range of electronic systems and power sources.

Package Shape: SQUARE

The square package shape provides a compact and efficient form factor, ideal for space-constrained applications.

No. of Terminals: 32

Having a high number of terminals offers versatile connectivity options and allows for integration with various components in a circuit.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures efficient power consumption and compatibility with lower voltage systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature enables reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures operational integrity even in extreme cold environments.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers enhanced thermal management and space-saving design.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, reducing the risk of disconnection or signal interference.

Maximum Seated Height: 1 mm

The low maximum seated height enables the clock generator to be installed in compact devices or applications with height restrictions.

Width: 5 mm

The compact width facilitates easy placement on a circuit board, optimizing space utilization and layout design.

Length: 5 mm

The short length of the clock generator further enhances its space-saving capabilities and overall efficiency in a design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance and durability in harsh industrial environments.

Peripheral IC Type: CLOCK GENERATOR, PROCESSOR SPECIFIC

Designed as a clock generator with processor-specific compatibility, this product is optimized for use in processor-based systems and applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic devices.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and enhances reliability by eliminating the risk of solder joint fatigue or cracking.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V provides a stable and standardized power input for consistent performance and compatibility.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for precise and compact connections, suitable for high-density circuit layouts.

Nominal Primary Clock/Crystal Frequency: 25 MHz

The nominal primary clock/crystal frequency of 25 MHz ensures accurate and reliable timing synchronization in electronic systems and communication interfaces.

Technical Specifications

Clock Generators NB3H5150MNG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

IT ALSO OPEARTES AT 3.3V NOMINAL SUPPLY

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Nominal Primary Clock/Crystal Frequency:

25 MHz

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

NB3H5150MNG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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