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NB3H5150-01MNTXG

Onsemi

NB3H5150-01MNTXG by Onsemi

NB3H5150-01MNTXG clock generator by Onsemi operates at a max output frequency of 156.25 MHz with a supply voltage range of 2.375V to 2.625V. This industrial-grade device, featuring CMOS technology, is ideal for processor-specific applications requiring precise timing control in a compact square package measuring 5mm x 5mm.

Median Price

$5.874

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 922 parts In-Stock

1+ parts

$7.060

100+ parts

$4.592

1k+ parts

$4.148

10k+ parts

$4.061

922

$7.060

$4.592

$4.148

$4.061

Mouser Electronics

USA . 513 parts In-Stock

1+ parts

$7.060

100+ parts

$4.600

1k+ parts

$4.020

10k+ parts

$3.960

513

$7.060

$4.600

$4.020

$3.960

Rochester

USA . 23,694 parts In-Stock

1+ parts

-

100+ parts

$3.750

1k+ parts

$3.360

10k+ parts

$3.160

23,694

-

$3.750

$3.360

$3.160

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$4.688

1k+ parts

$4.200

10k+ parts

$3.950

9,000

-

$4.688

$4.200

$3.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,945 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

1,945

$3.962

-

-

-

Vyrian

USA . 1,570 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

1,570

$4.170

-

-

-

Flip Electronics

USA . 23,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 201 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

201

$3.753

-

-

-

Corohmni

South Africa . 378 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

378

$4.170

-

-

-

SupplyDigital Components

Austria . 6,903 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,903

-

-

-

-

TANS Electronics

Latvia . 4,836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,836

-

-

-

-

Problanco Electronics

Mexico . 3,408 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,408

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Kulean Microsystems

USA . 2,614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,614

-

-

-

-

Kepictronics

USA . 548 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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548

-

-

-

-

UHIMA Technologies

Türkiye . 194 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

194

-

-

-

-

Overview

Elevate your clock generation with the NB3H5150-01MNTXG by Onsemi. Experience superior quality and precision engineering from a trusted manufacturer in the industry. This cutting-edge clock generator offers unmatched reliability and performance, making it ideal for a wide range of applications. Unlock new possibilities and optimize your systems with the NB3H5150-01MNTXG - where value meets innovation.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and secure mounting on PCBs, making it convenient for manufacturing and reducing assembly time.

Maximum Supply Voltage: 2.625 V

Operates within a safe voltage range, ensuring stable performance and longevity of the product.

Package Shape: SQUARE

Square package shape makes it easier to place and align on the PCB, optimizing space usage.

Maximum Output Clock Frequency: 156.25 MHz

High output clock frequency allows for fast and efficient operation, suitable for various applications that require precision timing.

No. of Terminals: 32

Having a higher number of terminals provides flexibility for connecting to other components and peripherals in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package style enhances heat dissipation and space-saving capabilities.

Minimum Supply Voltage: 2.375 V

Operates efficiently even at low supply voltages, ensuring compatibility with a wide range of systems and power sources.

Maximum Operating Temperature: 85 °C

Withstanding high operating temperatures ensures reliable performance in harsh environments or under heavy workload conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for applications where temperature fluctuations are common.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and good conductivity for reliable terminal connections.

Terminal Position: QUAD

Quad terminal positions enhance stability and mechanical strength during PCB assembly and component mounting.

Maximum Seated Height: 1 mm

Low seated height facilitates compact design and allows for tight PCB layouts, saving valuable space in the system.

Width: 5 mm

Narrow width enables efficient placement on the PCB, contributing to overall space optimization in the system design.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during manufacturing processes, ensuring proper soldering and component reliability.

Peak Reflow Temperature °C: 260

Withstands high peak reflow temperatures during soldering, ensuring reliable solder joints and component integrity.

Length: 5 mm

Compact length simplifies placement and routing on the PCB, contributing to a more streamlined and efficient board layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation over a wide temperature range, suitable for industrial applications with varying environmental conditions.

Peripheral IC Type: CLOCK GENERATOR, PROCESSOR SPECIFIC

Designed specifically for clock generation in processors, ensuring precise timing and synchronization for processor-related tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and stable performance, making it an efficient choice for clock generation applications.

Terminal Form: NO LEAD

No-lead terminal form eliminates the risk of lead contamination, ensuring environmental safety and compliance with modern manufacturing standards.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage provides a balanced operating range for stable and efficient performance in various systems and applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB, maximizing space utilization and enabling compact system designs.

Nominal Primary Clock/Crystal Frequency: 25 MHz

Nominal clock/crystal frequency provides a stable reference signal for accurate timing purposes, essential for clock generation and synchronization tasks.

Technical Specifications

Clock Generators NB3H5150-01MNTXG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

IT ALSO OPEARTES AT 3.3V NOMINAL SUPPLY

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

156.25 MHz

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Nominal Primary Clock/Crystal Frequency:

25 MHz

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB3H5150-01MNTXG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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