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NB2308AI2HDG

Onsemi

NB2308AI2HDG by Onsemi

NB2308AI2HDG clock driver by Onsemi operates at 3.3V, with 16 terminals and a max output current of 8A. It features a small outline package style, industrial temperature grade, and CMOS technology. Ideal for applications requiring precise timing control in electronic systems.

Median Price

$0.606

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,205 parts In-Stock

1+ parts

-

100+ parts

$0.595

1k+ parts

$0.493

10k+ parts

$0.440

4,205

-

$0.595

$0.493

$0.440

Verical

USA . 4,181 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.617

10k+ parts

$0.550

4,181

-

-

$0.617

$0.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 575 parts In-Stock

1+ parts

$0.463

100+ parts

-

1k+ parts

-

10k+ parts

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575

$0.463

-

-

-

Vyrian

USA . 3,960 parts In-Stock

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3,960

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,327 parts In-Stock

1+ parts

$0.438

100+ parts

-

1k+ parts

-

10k+ parts

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1,327

$0.438

-

-

-

Corohmni

South Africa . 232 parts In-Stock

1+ parts

$0.441

100+ parts

-

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-

232

$0.441

-

-

-

AZTECH Wire

Italy . 593 parts In-Stock

1+ parts

$18.990

100+ parts

-

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593

$18.990

-

-

-

Kulean Microsystems

USA . 8,321 parts In-Stock

1+ parts

-

100+ parts

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8,321

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TANS Electronics

Latvia . 8,198 parts In-Stock

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8,198

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SupplyDigital Components

Austria . 8,173 parts In-Stock

1+ parts

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8,173

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Continental Prestige Electronics

USA . 4,205 parts In-Stock

1+ parts

-

100+ parts

$0.415

1k+ parts

-

10k+ parts

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4,205

-

$0.415

-

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Problanco Electronics

Mexico . 3,217 parts In-Stock

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3,217

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Microchip USA

USA . 451 parts In-Stock

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451

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UHIMA Technologies

Türkiye . 261 parts In-Stock

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100+ parts

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1k+ parts

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261

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Overview

Enhance your electronic designs with the NB2308AI2HDG Clock Drivers & Buffers by Onsemi. Crafted with precision and quality, this product offers outstanding performance and reliability. Ideal for a wide range of applications, from consumer electronics to industrial machinery, this clock driver ensures seamless operation and improved efficiency. With Onsemi's reputation for excellence in semiconductor manufacturing, you can trust that you're getting a top-of-the-line product that delivers exceptional value and benefits to meet your needs. Upgrade your projects with the NB2308AI2HDG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the clock driver, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy integration onto printed circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of electronic systems and devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this clock driver can withstand elevated temperatures in industrial environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for greater flexibility and control over the signal output, making it suitable for a variety of applications.

Technology: CMOS

The CMOS technology used in this clock driver ensures low power consumption and high noise immunity, resulting in efficient operation and reliable performance.

Technical Specifications

Clock Drivers & Buffers NB2308AI2HDG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2308

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

15 MHz

Trade Compliance

NB2308AI2HDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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