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NB2305AI1DG

Onsemi

NB2305AI1DG by Onsemi

NB2305AI1DG clock driver by Onsemi operates at 3.3V, with 4 true outputs and a max frequency of 133.33MHz. It is ideal for industrial applications requiring precise timing synchronization in compact designs due to its small outline package and CMOS technology.

Median Price

$0.581

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$0.581

1k+ parts

$0.482

10k+ parts

$0.430

2

-

$0.581

$0.482

$0.430

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 121 parts In-Stock

1+ parts

$0.453

100+ parts

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121

$0.453

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Vyrian

USA . 4,885 parts In-Stock

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4,885

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LWI Electronics Inc

India . 490 parts In-Stock

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490

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Distributors (Availability)

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Corphita

USA . 1,821 parts In-Stock

1+ parts

$0.429

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1,821

$0.429

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Corohmni

South Africa . 213 parts In-Stock

1+ parts

$0.477

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213

$0.477

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AZTECH Wire

Italy . 890 parts In-Stock

1+ parts

$20.070

100+ parts

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890

$20.070

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Kulean Microsystems

USA . 7,411 parts In-Stock

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7,411

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Problanco Electronics

Mexico . 4,857 parts In-Stock

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4,857

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SupplyDigital Components

Austria . 3,953 parts In-Stock

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3,953

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TANS Electronics

Latvia . 2,721 parts In-Stock

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2,721

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UHIMA Technologies

Türkiye . 748 parts In-Stock

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748

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Perfect Parts

USA . 693 parts In-Stock

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Microchip USA

USA . 230 parts In-Stock

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Overview

Enhance your electronic designs with the NB2305AI1DG clock driver & buffer from Onsemi. Manufactured with precision and expertise, this small outline package offers outstanding performance in a variety of applications. With a maximum operating temperature of 85 °C and a power supply of 3.3V, this industrial-grade technology ensures reliability and efficiency. Trust Onsemi to deliver quality products that meet your needs. Experience seamless integration and improved functionality with the NB2305AI1DG - your solution for superior clock driving capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and secure installation on a circuit board, saving assembly time and ensuring a stable connection.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common and widely available supply voltage, making it compatible with various systems and components.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Operates in cold environments without any issues, providing versatility in different operating conditions.

No. of True Outputs: 4

Provides multiple outputs for driving clocks and buffers, offering flexibility in circuit design and functionality.

Minimum fmax: 133.33 MHz

Supports high-frequency operation, making it ideal for applications that require fast and precise clock signals.

Maximum Supply Voltage (Vsup): 3.6 V

Can handle slightly higher supply voltages, giving a margin of safety and compatibility with different power sources.

Technical Specifications

Clock Drivers & Buffers NB2305AI1DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2305

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

133.33 MHz

Trade Compliance

NB2305AI1DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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