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MUR3060PTG

Onsemi

MUR3060PTG by Onsemi

MUR3060PTG by Onsemi is a common cathode diode with 2 elements, featuring a max reverse recovery time of 0.06 us. It is designed for power applications, with a max operating temperature of 175°C and a max output current of 15A. The diode has a package style of flange mount and can handle up to 600V in repetitive peak reverse voltage.

Median Price

$2.384

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

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$2.384

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Vyrian

USA . 4,182 parts In-Stock

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Digiode

USA . 2,288 parts In-Stock

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Martec Srl

Italy . 120 parts In-Stock

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ComSIT Distribution GmbH

Germany . 90 parts In-Stock

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90

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LWI Electronics Inc

India . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 363 parts In-Stock

1+ parts

$0.010

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$0.010

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$0.010

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363

$0.010

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Component Stockers USA

USA . 1,355 parts In-Stock

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$0.970

100+ parts

$0.920

1k+ parts

$0.900

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1,355

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$0.920

$0.900

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Ampacity Inc.

Singapore . 887 parts In-Stock

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$2.010

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887

$2.010

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Corohmni

South Africa . 429 parts In-Stock

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$2.336

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429

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Bastille Electronics

Australia . 900 parts In-Stock

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$2.384

100+ parts

$2.265

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$2.152

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$2.122

900

$2.384

$2.265

$2.152

$2.122

Argo Parts USA

USA . 4,170 parts In-Stock

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$2.384

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Continental Prestige Electronics

USA . 2,858 parts In-Stock

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AZTECH Wire

Italy . 243 parts In-Stock

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$10.210

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Kepictronics

USA . 14,600 parts In-Stock

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Perfect Parts

USA . 10,976 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 7,411 parts In-Stock

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SupplyDigital Components

Austria . 7,258 parts In-Stock

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Lixinc

USA . 5,336 parts In-Stock

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Kulean Microsystems

USA . 4,574 parts In-Stock

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TANS Electronics

Latvia . 1,445 parts In-Stock

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UHIMA Technologies

Türkiye . 973 parts In-Stock

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Corphita

USA . 667 parts In-Stock

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Overview

Experience unparalleled power and efficiency with the MUR3060PTG diode rectifier by Onsemi. Crafted with precision and expertise, this product guarantees top-notch quality and performance. Ideal for power applications, this diode offers a common cathode configuration with two elements, ensuring smooth operation and reliability. Say goodbye to voltage fluctuations and hello to seamless power delivery with the MUR3060PTG. Upgrade your systems today and witness the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the diodes, ensuring a longer lifespan.

Maximum Reverse Recovery Time: 0.06 us

Ensures fast switching and efficient performance of the diodes.

Maximum Operating Temperature: 175 °C

Allows the diodes to be used in a wide range of temperatures, making them versatile for various applications.

Maximum Repetitive Peak Reverse Voltage: 600 V

Can handle high voltage levels, making it ideal for power applications.

Maximum Output Current: 15 A

Capable of handling high current loads, suitable for power applications.

Technical Specifications

Diodes & Rectifiers MUR3060PTG attributes and parameters. Explore more Diodes & Rectifiers devices from Onsemi

Specs

Additional Features:

FREE WHEELING DIODE

Application:

POWER

Case Connection:

CATHODE

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1.2 V

JEDEC-95 Code:

TO-218AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Non Repetitive Peak Forward Current:

150 A

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-65 Cel

Maximum Output Current:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

600 V

Maximum Reverse Recovery Time:

.06 us

Sub-Category:

Rectifier Diodes

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MUR3060PTG Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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