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MMBT6427LT3G

Onsemi

MMBT6427LT3G by Onsemi

MMBT6427LT3G by Onsemi is a NPN Darlington transistor with max VCEsat of 1.5V, hFE of 14000, and IC of 0.5A. Ideal for small signal applications in electronics due to its high gain and low saturation voltage. Operates b/w -55 to 150 °C, making it suitable for various temperature environments.

Median Price

$0.896

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 650 parts In-Stock

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$0.896

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Chip Stock

USA . 75,000 parts In-Stock

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Vyrian

USA . 12,103 parts In-Stock

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Digiode

USA . 1,014 parts In-Stock

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AZTECH Wire

Italy . 868 parts In-Stock

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$9.640

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QUARKTWIN TECHNOLOGY LTD

USA . 17,706 parts In-Stock

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Problanco Electronics

Mexico . 6,457 parts In-Stock

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Kulean Microsystems

USA . 5,107 parts In-Stock

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SupplyDigital Components

Austria . 4,042 parts In-Stock

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TANS Electronics

Latvia . 3,822 parts In-Stock

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Corphita

USA . 1,995 parts In-Stock

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UHIMA Technologies

Türkiye . 988 parts In-Stock

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Corohmni

South Africa . 182 parts In-Stock

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Overview

Enhance your electronic projects with the MMBT6427LT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Small Signal Bipolar Junction Transistors that offer superior performance and reliability. With its NPN Darlington configuration and maximum VCEsat of 1.5 V, this surface-mount transistor is perfect for a wide range of applications. From amplifiers to power management systems, this transistor provides exceptional value, efficiency, and versatility. Trust Onsemi to provide you with the innovative solutions you need to bring your designs to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, offering versatility in circuit design.

Configuration: DARLINGTON

Darlington configuration provides high current gain and allows for low power control of larger loads.

Surface Mount: YES

Enables easy installation on PCBs, saving space and simplifying manufacturing processes.

Maximum VCEsat: 1.5 V

Low VCEsat minimizes power loss and improves efficiency in the transistor's operation.

Terminal Form: GULL WING

Gull wing terminals facilitate secure and reliable connections during soldering.

No. of Terminals: 3

Simple 3-terminal design for easy integration into electronic circuits.

Maximum Power Dissipation (Abs): 0.3 W

Efficient power dissipation capability ensures the transistor can handle moderate power loads.

Package Style (Meter): SMALL OUTLINE

Compact small outline package saves space on the PCB and allows for dense circuit layouts.

Minimum DC Current Gain (hFE): 14000

High DC current gain provides reliable and stable amplification in circuit applications.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows for use in a variety of environmental conditions.

Maximum Collector-Base Capacitance: 7 pF

Low capacitance helps in reducing the risk of parasitic oscillations and ensures stable performance.

Maximum Collector-Emitter Voltage: 40 V

High collector-emitter voltage rating provides flexibility in circuit design and application.

Transistor Element Material: SILICON

Silicon material offers high performance, reliability, and temperature stability for the transistor.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for reliable operation even in harsh environmental conditions.

Maximum Collector Current (IC): 0.5 A

Able to handle moderate collector currents for various amplifier and switching applications.

Terminal Position: DUAL

Dual terminal position for versatile mounting options and ease of PCB layout.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MMBT6427LT3G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

7 pF

Maximum Collector-Emitter Voltage:

40 V

Configuration:

Minimum DC Current Gain (hFE):

14000

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Maximum VCEsat:

1.5 V

Trade Compliance

MMBT6427LT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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