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MLD1N06CLT4G

Onsemi

MLD1N06CLT4G by Onsemi

MLD1N06CLT4G by Onsemi is a N-CHANNEL Power FET with 59V DS Breakdown Voltage and 1.8A Pulsed Drain Current, ideal for SWITCHING applications. It features a SINGLE configuration with built-in BIPOLAR TRANSISTOR, DIODE, and RESISTOR in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has a max power dissipation of 40W at 150 °C temperature.

Median Price

$28.020

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 13 parts In-Stock

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$28.020

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Digiode

USA . 1,227 parts In-Stock

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$26.619

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Chip Stock

USA . 11,370 parts In-Stock

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Vyrian

USA . 2,748 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,252 parts In-Stock

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AZTECH Wire

Italy . 1,145 parts In-Stock

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$21.270

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Corphita

USA . 682 parts In-Stock

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$25.218

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Corohmni

South Africa . 173 parts In-Stock

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$28.020

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 27,860 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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SupplyDigital Components

Austria . 6,921 parts In-Stock

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Problanco Electronics

Mexico . 6,475 parts In-Stock

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Kulean Microsystems

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TANS Electronics

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UHIMA Technologies

Türkiye . 227 parts In-Stock

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GreenTree Electronics

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Overview

Unleash the power of innovation with the MLD1N06CLT4G by Onsemi! Designed with cutting-edge technology, this Power Field Effect Transistor (FET) offers unparalleled performance and reliability. Whether you're looking to enhance your switching applications or improve efficiency, this N-CHANNEL transistor is the perfect solution. With a robust design and high-quality materials, Onsemi ensures that every product delivers maximum value and benefits to customers. Trust Onsemi for all your power FET needs and experience the difference in quality and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy packaging provides good protection for the internal components of the FET, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN BIPOLAR TRANSISTOR, DIODE AND RESISTOR

Having a built-in bipolar transistor, diode, and resistor simplifies circuit design and saves space, making this FET suitable for compact applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low switching losses, ideal for power control circuits.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Minimum DS Breakdown Voltage: 59 V

With a minimum breakdown voltage of 59V, this FET can handle higher voltages, increasing its versatility in power applications.

Maximum Drain Current (ID): 2 A

Capable of handling a maximum drain current of 2A, this FET is suitable for medium to high-power applications.

Maximum Power Dissipation (Abs): 40 W

With a maximum power dissipation of 40W, this FET can effectively dissipate heat and operate efficiently at high power levels.

Maximum Operating Temperature: 150 °C

Operating at a maximum temperature of 150 °C ensures the FET can withstand high-temperature environments, enhancing its reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology provides improved performance and efficiency for the FET, making it a reliable choice for power applications.

Technical Specifications

Power Field Effect Transistors (FET) MLD1N06CLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

59 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

1 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1.8 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MLD1N06CLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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